{"title":"基于导电桥接随机存取存储器开关的射频系统级封装宽带数字衰减器","authors":"Zong-Rui Xu;Zhi-Yi Zhang;Lin-Sheng Wu;Jun-Fa Mao","doi":"10.1109/TCPMT.2024.3489882","DOIUrl":null,"url":null,"abstract":"A wideband digital conductive bridging random access memory (CBRAM)-based attenuator is proposed in this article, which can be used to realize reconfigurable RF systems-in-package (SiPs). The fabrication process is developed under the processing temperature lower than \n<inline-formula> <tex-math>$120~^{\\circ }$ </tex-math></inline-formula>\nC, compatible with the advanced packaging technology on silicon substrates. The CBRAM switches based on Nafion are integrated with bridged-T-type resistor subnetworks to form single-bit attenuation unit cells, with wide attenuation range and large operating bandwidth. The resistance values and layouts of TaN thin film resistors are optimized when considering the parasitic effects. A 5-bit attenuator prototype is designed for 5–15 GHz, which is highly integrated with the occupied area of \n<inline-formula> <tex-math>$0.84\\times 0.84$ </tex-math></inline-formula>\n mm2. The relative attenuation is from 1.0 to 31.3 dB at the central frequency, with a 2.2-dB insertion loss of the reference state. The return loss is better than 10 dB for all the 32 attenuation states. The root mean square (rms) attenuation error is less than 0.74 dB with a relative bandwidth of 100%. Moreover, the proposed digital CBRAM-based attenuator has the advantages of low actuation voltage and no dc power consumption, due to the nonvolatile RF switches used. It is a promising technique for the application of reconfigurable RF SiPs.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2321-2330"},"PeriodicalIF":2.3000,"publicationDate":"2024-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Wideband Digital Attenuator Based on Conductive Bridging Random Access Memory Switches for RF System-in-Package\",\"authors\":\"Zong-Rui Xu;Zhi-Yi Zhang;Lin-Sheng Wu;Jun-Fa Mao\",\"doi\":\"10.1109/TCPMT.2024.3489882\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A wideband digital conductive bridging random access memory (CBRAM)-based attenuator is proposed in this article, which can be used to realize reconfigurable RF systems-in-package (SiPs). The fabrication process is developed under the processing temperature lower than \\n<inline-formula> <tex-math>$120~^{\\\\circ }$ </tex-math></inline-formula>\\nC, compatible with the advanced packaging technology on silicon substrates. The CBRAM switches based on Nafion are integrated with bridged-T-type resistor subnetworks to form single-bit attenuation unit cells, with wide attenuation range and large operating bandwidth. The resistance values and layouts of TaN thin film resistors are optimized when considering the parasitic effects. A 5-bit attenuator prototype is designed for 5–15 GHz, which is highly integrated with the occupied area of \\n<inline-formula> <tex-math>$0.84\\\\times 0.84$ </tex-math></inline-formula>\\n mm2. The relative attenuation is from 1.0 to 31.3 dB at the central frequency, with a 2.2-dB insertion loss of the reference state. The return loss is better than 10 dB for all the 32 attenuation states. The root mean square (rms) attenuation error is less than 0.74 dB with a relative bandwidth of 100%. Moreover, the proposed digital CBRAM-based attenuator has the advantages of low actuation voltage and no dc power consumption, due to the nonvolatile RF switches used. It is a promising technique for the application of reconfigurable RF SiPs.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"14 12\",\"pages\":\"2321-2330\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10741241/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10741241/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A Wideband Digital Attenuator Based on Conductive Bridging Random Access Memory Switches for RF System-in-Package
A wideband digital conductive bridging random access memory (CBRAM)-based attenuator is proposed in this article, which can be used to realize reconfigurable RF systems-in-package (SiPs). The fabrication process is developed under the processing temperature lower than
$120~^{\circ }$
C, compatible with the advanced packaging technology on silicon substrates. The CBRAM switches based on Nafion are integrated with bridged-T-type resistor subnetworks to form single-bit attenuation unit cells, with wide attenuation range and large operating bandwidth. The resistance values and layouts of TaN thin film resistors are optimized when considering the parasitic effects. A 5-bit attenuator prototype is designed for 5–15 GHz, which is highly integrated with the occupied area of
$0.84\times 0.84$
mm2. The relative attenuation is from 1.0 to 31.3 dB at the central frequency, with a 2.2-dB insertion loss of the reference state. The return loss is better than 10 dB for all the 32 attenuation states. The root mean square (rms) attenuation error is less than 0.74 dB with a relative bandwidth of 100%. Moreover, the proposed digital CBRAM-based attenuator has the advantages of low actuation voltage and no dc power consumption, due to the nonvolatile RF switches used. It is a promising technique for the application of reconfigurable RF SiPs.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.