高性能二维场效应晶体管栅极介电材料的研究框架

Ankit Kumar;Lin Xu;Albert Ho;Arnab Pal;Kunjesh Agashiwala;Kamyar Parto;Wei Cao;Kaustav Banerjee
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摘要

栅极介电体(GD)的选择和工程设计对二维场效应晶体管(fet)的性能和能效至关重要,它们被认为是小于10 nm栅极长度(Lg)金属氧化物半导体场效应晶体管(mosfet)的主要候选器件。尽管近年来半导体工业在实现基于过渡金属二硫族化物(TMDs)的高性能二维场效应管方面取得了显著进展,但实现快速开关速度和低器件漏电流仍然是一个公开的挑战。更具体地说,介电-二维界面上的陷阱和介电体缺陷对器件性能的影响尚未得到深入研究。本文以一种常见的2D-TMD材料二硫化钼(MoS2)为例,利用严格的从头算密度泛函理论(DFT)和非平衡格林函数(NEGF)输运,探讨了各种GDs和介电堆的界面、陷阱和缺陷。我们的框架和分析为n型2D MoS2 fet的设计提供了有价值的见解,包括栅漏(IGL)、亚阈值摆幅(SS)和导通电流(ION),并且可以扩展到优化其他2D fet的设计和性能。更具体地说,我们证明了单层(1L-)和双层(2L-) LaOCl/HfO2是有前途的GD堆叠,可以在n型2D fet中实现IGL, SS和ION所需的IRDS值。最后,我们开发了一个框架来推导适用于n型和p型二维场效应管的材料/界面特性的设计窗口,并确定潜在的GD材料作为跨不同Lg的n型二维场效应管的钝化/播种层。结果表明,LaOCl是Lg = 7 nm的有希望的候选材料,而包括LaOCl和hBN在内的几种材料在Lg = 10 nm是可行的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Framework for Exploring Gate-Dielectric Materials for High-Performance Two-Dimensional Field-Effect-Transistors
The choice and engineering of the gate-dielectric (GD) is of paramount importance to the performance and energy-efficiency of two-dimensional (2D) field-effect-transistors (FETs) that are considered to be primary candidates for sub-10 nm gate length (L g ) metal-oxide-semiconductor FETs (MOSFETs). Despite remarkable progress achieved in recent years by the semiconductor-industry towards realization of high-performance 2D FETs based on transition-metal dichalcogenides (TMDs), achieving fast switching speeds and low device leakage currents remain an open challenge. More specifically, the effect of traps at the dielectric-2D interface and bulk defects in the dielectric on device performance have not been thoroughly investigated. In this paper, taking a common 2D-TMD material molybdenum disulfide (MoS 2 ) as an example, we explore various GDs and dielectric-stacks – their interfaces, traps and defects, by using rigorous ab-initio density-functional-theory (DFT) and non-equilibrium-Green's-function (NEGF) transport. Our framework and analysis provide valuable insights into the design of n-type 2D MoS 2 FETs, including their gate leakage (I GL ), subthreshold swing (SS), and ON-current (I ON ), and they can be extended to optimize the design and performance of other 2D FETs. More specifically, we demonstrate that monolayer (1L-) and bilayer (2L-) LaOCl/HfO 2 are promising GD stacks to achieve IRDS required values for I GL , SS, and I ON in n-type 2D FETs. Finally, we develop a framework to derive the design-window in terms of material/interface properties valid for both n-type and p-type 2D FETs and identify potential GD materials as a passivation/seeding layer across different L g for n-type 2D FETs. The results highlight LaOCl as a promising candidate for L g = 7 nm while several materials, including LaOCl and h BN, are viable for L g = 10 nm.
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