Jui-Tse Hsu;Shawn S. H. Hsu;Ting-Chang Chang;Chen-Hsin Lien;Ting-Tzu Kuo;Chien-Hung Yeh;Jia-Hong Lin;Ya-Huan Lee;Cheng-Hsien Lin;Wei-Chieh Hung;I-Yu Huang
{"title":"用电容电压测量法研究GaN hemt中漏极电流的弧形结漏极电压","authors":"Jui-Tse Hsu;Shawn S. H. Hsu;Ting-Chang Chang;Chen-Hsin Lien;Ting-Tzu Kuo;Chien-Hung Yeh;Jia-Hong Lin;Ya-Huan Lee;Cheng-Hsien Lin;Wei-Chieh Hung;I-Yu Huang","doi":"10.1109/TDMR.2024.3467344","DOIUrl":null,"url":null,"abstract":"In this study, the measure-stress-measure (MSM) technique under the arc-shaped kink drain voltage (VD,kink) conditions is applied to investigate the \n<inline-formula> <tex-math>${\\mathrm { V}}_{\\mathrm { D,kink}}$ </tex-math></inline-formula>\n in GaN high electron mobility transistors (HEMTs). Forward and reverse transfer curves indicate that the \n<inline-formula> <tex-math>${\\mathrm { V}}_{\\mathrm { D,kink}}$ </tex-math></inline-formula>\n would change with gate voltages increasing. However, no previous study has investigated the exact location of traps that would dominate the loci of VD,kink. The results suggest that the trend of on-state current (Ion) degradation is caused by threshold voltage (Vt) shift. Hence, it can be determined that the \n<inline-formula> <tex-math>${\\mathrm { V}}_{\\mathrm { D,kink}}$ </tex-math></inline-formula>\n is related to the degree of impact ionization, which is dominant by the holes generation in the buffer. In addition, the capacitance-voltage (C-V) measurements reveal that holes generated through impact ionization at the gate edge are responsible for the shift in VD,kink. This physical mechanism is further supported by temperature-dependent analysis. Finally, the results offer a novel C-V measurement to characterize and model the physical mechanisms of the kink effect, which is governed by hot carrier degradation in GaN HEMTs.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"544-548"},"PeriodicalIF":2.5000,"publicationDate":"2024-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Investigating the Arc-Shaped Kink Drain Voltage of Drain Current With Capacitance-Voltage Measurement Method in GaN HEMTs\",\"authors\":\"Jui-Tse Hsu;Shawn S. H. Hsu;Ting-Chang Chang;Chen-Hsin Lien;Ting-Tzu Kuo;Chien-Hung Yeh;Jia-Hong Lin;Ya-Huan Lee;Cheng-Hsien Lin;Wei-Chieh Hung;I-Yu Huang\",\"doi\":\"10.1109/TDMR.2024.3467344\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, the measure-stress-measure (MSM) technique under the arc-shaped kink drain voltage (VD,kink) conditions is applied to investigate the \\n<inline-formula> <tex-math>${\\\\mathrm { V}}_{\\\\mathrm { D,kink}}$ </tex-math></inline-formula>\\n in GaN high electron mobility transistors (HEMTs). Forward and reverse transfer curves indicate that the \\n<inline-formula> <tex-math>${\\\\mathrm { V}}_{\\\\mathrm { D,kink}}$ </tex-math></inline-formula>\\n would change with gate voltages increasing. However, no previous study has investigated the exact location of traps that would dominate the loci of VD,kink. The results suggest that the trend of on-state current (Ion) degradation is caused by threshold voltage (Vt) shift. Hence, it can be determined that the \\n<inline-formula> <tex-math>${\\\\mathrm { V}}_{\\\\mathrm { D,kink}}$ </tex-math></inline-formula>\\n is related to the degree of impact ionization, which is dominant by the holes generation in the buffer. In addition, the capacitance-voltage (C-V) measurements reveal that holes generated through impact ionization at the gate edge are responsible for the shift in VD,kink. This physical mechanism is further supported by temperature-dependent analysis. 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Investigating the Arc-Shaped Kink Drain Voltage of Drain Current With Capacitance-Voltage Measurement Method in GaN HEMTs
In this study, the measure-stress-measure (MSM) technique under the arc-shaped kink drain voltage (VD,kink) conditions is applied to investigate the
${\mathrm { V}}_{\mathrm { D,kink}}$
in GaN high electron mobility transistors (HEMTs). Forward and reverse transfer curves indicate that the
${\mathrm { V}}_{\mathrm { D,kink}}$
would change with gate voltages increasing. However, no previous study has investigated the exact location of traps that would dominate the loci of VD,kink. The results suggest that the trend of on-state current (Ion) degradation is caused by threshold voltage (Vt) shift. Hence, it can be determined that the
${\mathrm { V}}_{\mathrm { D,kink}}$
is related to the degree of impact ionization, which is dominant by the holes generation in the buffer. In addition, the capacitance-voltage (C-V) measurements reveal that holes generated through impact ionization at the gate edge are responsible for the shift in VD,kink. This physical mechanism is further supported by temperature-dependent analysis. Finally, the results offer a novel C-V measurement to characterize and model the physical mechanisms of the kink effect, which is governed by hot carrier degradation in GaN HEMTs.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.