金属化3d打印塑料谐振器显示4 K以下的超导性

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-28 DOI:10.1109/TCPMT.2024.3487264

J. Bourhill;G. Cochet;J. Haumant;V. Vlaminck;A. Manchec;M. E. Tobar;V. Castel

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引用次数: 0

摘要

我们报告了在3d打印的金属化塑料装置中观察到的超导转变。用光敏聚合物树脂3d打印出一个圆柱形腔，然后沉积一层20万美元的锡。在13.41 GHz的谐振TE微波模式下，一旦冷却到3.72 K（锡的超导转变温度）以下，其损耗就会降低一个数量级，模式的q因子从2.7 \乘以10^{4}$增加到4.0 \乘以10^{5}$。

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Metalized 3-D Printed Plastic Resonator Demonstrating Superconductivity Below 4 K

We report the observation of a superconducting transition in a 3-D printed, metalized plastic device. A cylindrical cavity is 3-D printed from a photosensitive polymer resin and then a 20-

$\mu $

m layer of tin is deposited. A resonant TE microwave mode at 13.41 GHz is observed to reduce its losses by an order of magnitude once it is cooled below 3.72 K, the superconducting transition temperature of tin, with the mode’s Q-factor increasing from

$2.7 \times 10^{4}$

$4.0 \times 10^{5}$

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.