器件、材料、工艺技术和微电子生态系统超越器件小型化隧道出口

H.-S. Philip Wong;Subhasish Mitra
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摘要

跨系统堆栈的许多创新——从算法和架构到电路、器件、制造工艺和材料——将在系统级提供巨大的协同效益。虽然传统智慧是针对每个晶体管的成本进行优化,并节省晶体管的使用,但其他优化目标正变得高度相关。例子包括功率和能源消耗,制造过程的复杂性,设计,制造和测试流程,以及开发和产品化的周期时间。这些都对未来的器件、材料、工艺技术和微电子生态系统具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Devices, Materials, Process Technologies, and Microelectronic Ecosystem Beyond the Exit of the Device Miniaturization Tunnel
Many innovations across the system stack – from algorithms and architectures to circuits, devices, fabrication processes, and materials – will provide large synergistic benefits at the system level. While conventional wisdom optimizes for cost per transistor and economizes on the use of transistors, other optimization targets are becoming highly relevant moving forward. Examples include power and energy consumption, complexity of fabrication process, design, manufacturing and testing flows, and cycle time for development and productization. These all have important implications for devices, materials, process technologies, and the microelectronics ecosystem of the future.
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