应对 1T 多层 FeFET 阵列可靠性挑战的紧凑型写入方案:变化、耐久性和写入干扰

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yuejia Zhou;Hanyong Shao;Weiqin Huang;Runteng Zhu;Yihan Zhang;Ru Huang;Kechao Tang
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引用次数: 0

摘要

多电平单元(MLC)铁电场效应晶体管(FeFET)面临着关键的可靠性挑战,包括变化、耐久性和写入干扰。在这项工作中,我们提出了一种创新的解决方案,在紧凑的写入方案中应对所有这三个挑战。结合纠错、耐久性恢复和自补偿写入,所提出的方案实现了错误率(ER)降低6倍,耐久性提高100倍,Vth位移降低7倍。实验证明,在制造的 1T FeFET 阵列中,可靠的 2 比特/单元存储具有 10^{{8}}$ 周期的高耐用性和写入抗干扰性。这种写入方案是在单一工作流程内实现的,可以在操作电路中轻松实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Compact Writing Scheme for the Reliability Challenges in 1T Multi-Level FeFET Array: Variation, Endurance, and Write Disturb
Multi-level cell (MLC) ferroelectric FETs (FeFETs) face critical reliability challenges including variation, endurance and write disturb. In this work, we proposed an innovative solution to tackle all the three challenges within a compact writing scheme. Combining error correction, endurance recovery, and self-compensated writing, the proposed scheme achieves a $\gt 6\times $ reduction in error ratio (ER), a >100 improvement in endurance, and a $\gt 7\times $ reduction in Vth shift. Reliable 2 bits/cell storage with high endurance of $10^{{8}}$ cycles and write-disturb immunity is experimentally demonstrated in the fabricated 1T FeFET array. This writing scheme is realized within a single work flow, and can be readily implemented in the operation circuits.
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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