FV520B 钢激光冲击强化疲劳特性的实验和数值模拟

IF 4.6 2区 物理与天体物理 Q1 OPTICS
Dan Jin, Zhuang Liu, Zhuoqun Li, Chaoyue Guo, Mengying Sun
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引用次数: 0

摘要

对 FV520B 钢圆柱试样进行了激光冲击强化(LSP)实验、低循环疲劳实验、显微硬度和残余应力测量以及扫描电子显微镜(SEM)分析。此外,还使用 ABAQUS 软件预测了 LSP 工艺后的疲劳寿命。实验结果表明,LSP 产生的表面压缩残余应力能有效抑制疲劳裂纹的产生和扩展,从而延长 FV520B 钢的疲劳寿命。在应变振幅为 ± 0.5 %、±0.6 %、±0.7 % 和 ± 1.0 % 时,试样的疲劳寿命分别提高了 132.2 %、0.4 %、18.0 % 和 88.8 %。试样表面测得的残余应力为 -90 兆帕,LSP 后表面硬度值提高了 48%。扫描电子显微镜结果显示,LSP 后呈现出单个裂纹源引发裂纹的特征。使用 ABAQUS 进行的单点 LSP 模拟结果表明,圆周表面的压缩残余应力较低,为 30 兆帕,而平面表面的残余应力值较高,为 45 兆帕。为模拟 LSP 对圆周表面的影响,采用了 "多点连续冲击 "模拟策略。结果发现,获得的平均压缩残余应力为 92 兆帕,此外,在次表面和圆柱体内部检测到的拉伸残余应力从 8 兆帕到 29 兆帕不等。值得注意的是,LSP 试样在应变振幅为 ± 0.5%、±0.6%、±0.7% 和 ± 1.0% 时的模拟疲劳寿命与实验疲劳寿命之间的差异很小,仅在 10.4% 到 22.3% 之间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experiments and numerical simulations on fatigue properties of laser shock peening for FV520B steel
Laser shock peening (LSP) experiments, low cycle fatigue experiments, microhardness and residual stress measurements, and scanning electron microscopy (SEM) analyses were conducted on FV520B steel cylindrical specimens. Additionally, ABAQUS software was employed to predict fatigue life following the LSP process. The experimental results indicate that the surface compressive residual stresses induced by LSP inhibit both the initiation and propagation of fatigue cracks effectively, thereby prolonging the fatigue life of FV520B steel. The fatigue life of specimens at strain amplitudes of ± 0.5 %, ±0.6 %, ±0.7 %, and ± 1.0 % is improved by 132.2 %, 0.4 %, 18.0 %, and 88.8 %, respectively. A residual stress of −90 MPa is measured on the surface of the specimen and the surface hardness value increase by 48 % after LSP. The SEM results reveal that the characteristic of single crack sources for crack initiation is presented after LSP. The results of single point LSP simulation using ABAQUS demonstrate that the circumferential surface experiences a lower compressive residual stress of 30 MPa compared to a higher value of 45 MPa on the planar surface, this discrepancy arises due to rapidly decay associated with reduced rebound tensile strain on convex surfaces. A “multi-point continuous shock” simulation strategy was implemented for modeling LSP effects on the circumferential surface. The average compressive residual stress achieved was found to be 92 MPa, additionally, tensile residual stresses ranging from 8 MPa to 29 MPa were detected within secondary surfaces and inside the cylinder. Notably, discrepancies between simulated and experimental fatigue lives for LSP specimens across strain amplitudes of ± 0.5 %, ±0.6 %, ±0.7 %, and ± 1.0 % were minimal-ranging only between 10.4 % and 22.3 %.
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来源期刊
CiteScore
8.50
自引率
10.00%
发文量
1060
审稿时长
3.4 months
期刊介绍: Optics & Laser Technology aims to provide a vehicle for the publication of a broad range of high quality research and review papers in those fields of scientific and engineering research appertaining to the development and application of the technology of optics and lasers. Papers describing original work in these areas are submitted to rigorous refereeing prior to acceptance for publication. The scope of Optics & Laser Technology encompasses, but is not restricted to, the following areas: •development in all types of lasers •developments in optoelectronic devices and photonics •developments in new photonics and optical concepts •developments in conventional optics, optical instruments and components •techniques of optical metrology, including interferometry and optical fibre sensors •LIDAR and other non-contact optical measurement techniques, including optical methods in heat and fluid flow •applications of lasers to materials processing, optical NDT display (including holography) and optical communication •research and development in the field of laser safety including studies of hazards resulting from the applications of lasers (laser safety, hazards of laser fume) •developments in optical computing and optical information processing •developments in new optical materials •developments in new optical characterization methods and techniques •developments in quantum optics •developments in light assisted micro and nanofabrication methods and techniques •developments in nanophotonics and biophotonics •developments in imaging processing and systems
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