氮化时间对不同蓝宝石衬底偏角上氮化铝层生长的影响

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Noratiqah Yusop , Yusnizam Yusuf , Muhammad Esmed Alif Samsudin , Nor Syafiqah Azmi , Mohd Anas Ahmad , Narong Chanlek , Norzaini Zainal
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引用次数: 0

摘要

这项研究阐述了氮化时间和蓝宝石偏离切割角度在改善氮化铝层生长中的作用。研究发现,氮化会形成 AlON 层,该层有助于改善氮化铝层的原子排列。根据 XRD-rocking 曲线的 FHWMs(XRC-FWHMs),氮化时间越长,TDD 越小,最长可达 20 分钟,尤其是生长在 0.5° 偏切蓝宝石上的氮化铝层。同时,正如 N1s XPS 光谱显示的那样,长时间的氮化会破坏 AlON 层,从而增加 TDD。总的来说,蓝宝石偏离切割角度对 TDD 降低的影响不大,特别是在氮化时间较长的情况下。此外,氮化时间越长,氮化铝层的表面粗糙度就越低,包括在偏离切割角度为 3.0° 的蓝宝石上生长的氮化铝层。值得注意的是,在这项研究中,通常在偏切角较高的蓝宝石上观察到的氮化铝表面宏观阶梯并不明显。这表明氮化可以抑制大台阶或台阶堆积的产生。不过,这也限制了 TDs 的倾斜度,而 TDs 的倾斜度也是降低 TDD 的关键。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of nitridation time on growth of AlN layers on different sapphire substrate off-cut angles
This work describes the role of nitridation time and off-cut angles of sapphire in improving growth of AlN layers. It was found that the nitridation formed AlON layer, of which this layer can be useful for improving the atomic arrangement of overgrown AlN layers. Based on FHWMs of XRD-rocking curve (XRC-FWHMs), the TDD decreases with increasing nitridation time up to 20 min, especially for the AlN layer grown on 0.5° off-cut sapphire. Meanwhile, as revealed by N1s XPS spectra, prolonged nitridation tends to destroy the AlON layer, thereby increasing the TDD. In general, the impact of the sapphire off-cut angles on the TDD reduction is insignificant, especially with longer nitridation. Moreover, the surface roughness of the AlN layers can be reduced by increasing nitridation time, including the ones grown on 3.0° off-cut sapphire. It is worth noting that macro-steps typically observed on the surface of AlN on higher off-cut angles of sapphire are less evident in this work. This indicates that the initiation of macro-steps or step-bunching can be suppressed by nitridation. However, this limits the TDs inclination which is also an essential in reducing the TDD.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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