Noratiqah Yusop , Yusnizam Yusuf , Muhammad Esmed Alif Samsudin , Nor Syafiqah Azmi , Mohd Anas Ahmad , Narong Chanlek , Norzaini Zainal
{"title":"氮化时间对不同蓝宝石衬底偏角上氮化铝层生长的影响","authors":"Noratiqah Yusop , Yusnizam Yusuf , Muhammad Esmed Alif Samsudin , Nor Syafiqah Azmi , Mohd Anas Ahmad , Narong Chanlek , Norzaini Zainal","doi":"10.1016/j.mssp.2024.109130","DOIUrl":null,"url":null,"abstract":"<div><div>This work describes the role of nitridation time and off-cut angles of sapphire in improving growth of AlN layers. It was found that the nitridation formed AlON layer, of which this layer can be useful for improving the atomic arrangement of overgrown AlN layers. Based on FHWMs of XRD-rocking curve (XRC-FWHMs), the TDD decreases with increasing nitridation time up to 20 min, especially for the AlN layer grown on 0.5° off-cut sapphire. Meanwhile, as revealed by N1s XPS spectra, prolonged nitridation tends to destroy the AlON layer, thereby increasing the TDD. In general, the impact of the sapphire off-cut angles on the TDD reduction is insignificant, especially with longer nitridation. Moreover, the surface roughness of the AlN layers can be reduced by increasing nitridation time, including the ones grown on 3.0° off-cut sapphire. It is worth noting that macro-steps typically observed on the surface of AlN on higher off-cut angles of sapphire are less evident in this work. This indicates that the initiation of macro-steps or step-bunching can be suppressed by nitridation. However, this limits the TDs inclination which is also an essential in reducing the TDD.</div></div>","PeriodicalId":18240,"journal":{"name":"Materials Science in Semiconductor Processing","volume":"187 ","pages":"Article 109130"},"PeriodicalIF":4.2000,"publicationDate":"2024-11-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Influence of nitridation time on growth of AlN layers on different sapphire substrate off-cut angles\",\"authors\":\"Noratiqah Yusop , Yusnizam Yusuf , Muhammad Esmed Alif Samsudin , Nor Syafiqah Azmi , Mohd Anas Ahmad , Narong Chanlek , Norzaini Zainal\",\"doi\":\"10.1016/j.mssp.2024.109130\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This work describes the role of nitridation time and off-cut angles of sapphire in improving growth of AlN layers. It was found that the nitridation formed AlON layer, of which this layer can be useful for improving the atomic arrangement of overgrown AlN layers. Based on FHWMs of XRD-rocking curve (XRC-FWHMs), the TDD decreases with increasing nitridation time up to 20 min, especially for the AlN layer grown on 0.5° off-cut sapphire. Meanwhile, as revealed by N1s XPS spectra, prolonged nitridation tends to destroy the AlON layer, thereby increasing the TDD. In general, the impact of the sapphire off-cut angles on the TDD reduction is insignificant, especially with longer nitridation. Moreover, the surface roughness of the AlN layers can be reduced by increasing nitridation time, including the ones grown on 3.0° off-cut sapphire. It is worth noting that macro-steps typically observed on the surface of AlN on higher off-cut angles of sapphire are less evident in this work. This indicates that the initiation of macro-steps or step-bunching can be suppressed by nitridation. However, this limits the TDs inclination which is also an essential in reducing the TDD.</div></div>\",\"PeriodicalId\":18240,\"journal\":{\"name\":\"Materials Science in Semiconductor Processing\",\"volume\":\"187 \",\"pages\":\"Article 109130\"},\"PeriodicalIF\":4.2000,\"publicationDate\":\"2024-11-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science in Semiconductor Processing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1369800124010266\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science in Semiconductor Processing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1369800124010266","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Influence of nitridation time on growth of AlN layers on different sapphire substrate off-cut angles
This work describes the role of nitridation time and off-cut angles of sapphire in improving growth of AlN layers. It was found that the nitridation formed AlON layer, of which this layer can be useful for improving the atomic arrangement of overgrown AlN layers. Based on FHWMs of XRD-rocking curve (XRC-FWHMs), the TDD decreases with increasing nitridation time up to 20 min, especially for the AlN layer grown on 0.5° off-cut sapphire. Meanwhile, as revealed by N1s XPS spectra, prolonged nitridation tends to destroy the AlON layer, thereby increasing the TDD. In general, the impact of the sapphire off-cut angles on the TDD reduction is insignificant, especially with longer nitridation. Moreover, the surface roughness of the AlN layers can be reduced by increasing nitridation time, including the ones grown on 3.0° off-cut sapphire. It is worth noting that macro-steps typically observed on the surface of AlN on higher off-cut angles of sapphire are less evident in this work. This indicates that the initiation of macro-steps or step-bunching can be suppressed by nitridation. However, this limits the TDs inclination which is also an essential in reducing the TDD.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
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Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.