M. Bendra , R.L. de Orio , S. Selberherr , W. Goes , V. Sverdlov
{"title":"通过后跳实现超大规模 STT-MRAM 的多级单元","authors":"M. Bendra , R.L. de Orio , S. Selberherr , W. Goes , V. Sverdlov","doi":"10.1016/j.sse.2024.109027","DOIUrl":null,"url":null,"abstract":"<div><div>The development of advanced magnetic tunnel junctions with a footprint in the single-digit nanometer range can be achieved using structures with an elongated and composite ferromagnetic free layer. Using advanced modeling techniques, we investigated the back-hopping effect in ultra-scaled STT-MRAM devices, defined as the unintended switching of the last part of the free layer, leading to an undesired magnetization state of the free layer. To understand the switching of the free layer, the torque acting on both parts of the composite-free layer must be studied in detail. A reduction in the size of MRAM components to increase the memory density may lead to back-hopping. However, the observed back-hopping effect can also be exploited for the realization of multi-level cells. For this purpose, we have carefully investigated the switching behavior of a device with several tunnel barrier interfaces and a few nanometers in diameter. Our studies on ultra-scaled STT-MRAM devices highlight the significant back-hopping effect which, when harnessed, can enable multi-bit cells with four distinct states, enhancing storage and functionality. These insights are pivotal for the design and optimization of future miniaturized spintronics devices.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"223 ","pages":"Article 109027"},"PeriodicalIF":1.4000,"publicationDate":"2024-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A multi-level cell for ultra-scaled STT-MRAM realized by back-hopping\",\"authors\":\"M. Bendra , R.L. de Orio , S. Selberherr , W. Goes , V. Sverdlov\",\"doi\":\"10.1016/j.sse.2024.109027\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The development of advanced magnetic tunnel junctions with a footprint in the single-digit nanometer range can be achieved using structures with an elongated and composite ferromagnetic free layer. Using advanced modeling techniques, we investigated the back-hopping effect in ultra-scaled STT-MRAM devices, defined as the unintended switching of the last part of the free layer, leading to an undesired magnetization state of the free layer. To understand the switching of the free layer, the torque acting on both parts of the composite-free layer must be studied in detail. A reduction in the size of MRAM components to increase the memory density may lead to back-hopping. However, the observed back-hopping effect can also be exploited for the realization of multi-level cells. For this purpose, we have carefully investigated the switching behavior of a device with several tunnel barrier interfaces and a few nanometers in diameter. Our studies on ultra-scaled STT-MRAM devices highlight the significant back-hopping effect which, when harnessed, can enable multi-bit cells with four distinct states, enhancing storage and functionality. These insights are pivotal for the design and optimization of future miniaturized spintronics devices.</div></div>\",\"PeriodicalId\":21909,\"journal\":{\"name\":\"Solid-state Electronics\",\"volume\":\"223 \",\"pages\":\"Article 109027\"},\"PeriodicalIF\":1.4000,\"publicationDate\":\"2024-11-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Solid-state Electronics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S003811012400176X\",\"RegionNum\":4,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Solid-state Electronics","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S003811012400176X","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A multi-level cell for ultra-scaled STT-MRAM realized by back-hopping
The development of advanced magnetic tunnel junctions with a footprint in the single-digit nanometer range can be achieved using structures with an elongated and composite ferromagnetic free layer. Using advanced modeling techniques, we investigated the back-hopping effect in ultra-scaled STT-MRAM devices, defined as the unintended switching of the last part of the free layer, leading to an undesired magnetization state of the free layer. To understand the switching of the free layer, the torque acting on both parts of the composite-free layer must be studied in detail. A reduction in the size of MRAM components to increase the memory density may lead to back-hopping. However, the observed back-hopping effect can also be exploited for the realization of multi-level cells. For this purpose, we have carefully investigated the switching behavior of a device with several tunnel barrier interfaces and a few nanometers in diameter. Our studies on ultra-scaled STT-MRAM devices highlight the significant back-hopping effect which, when harnessed, can enable multi-bit cells with four distinct states, enhancing storage and functionality. These insights are pivotal for the design and optimization of future miniaturized spintronics devices.
期刊介绍:
It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.