基于密度的带噪声应用空间聚类 (DBSCAN) 用于晶圆探测测试高级质量控制的探测卡生产

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Chen-Fu Chien;Butsayarin Suwattananuruk
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引用次数: 0

摘要

晶圆探测测试是通过探测卡作为测试仪与制造晶圆上的集成电路之间的测试信号接口来选择已知好芯片的关键。探针卡的一致性对于确保测试数据的完整性至关重要。受现实需求的驱动,本研究旨在开发一种有效的空间聚类方法,在考虑时域反射仪(TDR)数据的同时选择印刷电路板材料。为了评估其有效性,我们使用在真实环境中收集的 20 个数据集进行了实验,将所提出的 DBSCAN 与三种空间聚类模型(包括聚合分层聚类 (AHC)、K-means 和光谱聚类)进行了比较。在台湾一家领先的半导体测试公司进行了实证研究,以进行验证。结果表明,对于单信号和差分信号,所提出的方法分别能将材料选择的阻抗值提高至少 15%和 25%。因此,建议的解决方案可以有效地减少内在差异,提高探测测试的完整性,从而降低生产商的风险和客户的风险。事实上,所开发的解决方案可用于加强半导体供应链的虚拟垂直整合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test
Wafer probing test is crucial for selecting the known good dies via the probe card as the testing signal interface between the tester and the integrated circuits on the fabricated wafers. The consistency of probe cards is critical to ensure the integrity of the testing data. Motivated by realistic needs, this research aims to develop an effective approach for spatial clustering to select PCB materials while considering Time Domain Reflectometry (TDR) data. To estimate the validity, experiments are conducted with 20 datasets collected in real settings to compare the proposed DBSCAN with three spatial clustering models including Agglomerative Hierarchical Clustering (AHC), K-means, and Spectral Clustering. An empirical study is conducted in a lead semiconductor testing company in Taiwan for validation. The results have shown that the proposed approach can improve the impedance value of material selection by at least 15% for single-signal and 25% for differential signals, respectively. Thus, the proposed solution can effectively reduce intrinsic variance and enhance probing test integrity to reduce both the producer’s risk and the customer’s risk. Indeed, the developed solution is implemented to enhance virtual vertical integration for the semiconductor supply chain.
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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