利用 CMOS-RFIC 进行太赫兹传感:使用 300-GHz MIMO 雷达进行短距离成像的可行性验证

IF 2.2 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Ichiro Somada;Akihito Hirai;Akinori Taira;Keigo Nakatani;Kazuaki Ishioka;Takuma Nishimura;Koji Yamanaka
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引用次数: 0

摘要

为解决各种社会问题,传感技术受到了广泛关注。太赫兹波结合了光的高分辨率和无线电波的高透明度,能够对内部结构背后的障碍物进行可视化。因此,它为新的解决方案提供了潜力。这封信介绍了基于全数字 MIMO 雷达概念的短距离传感系统的概况、采用 CMOS 技术的 300 GHz 射频集成电路的设计和基本评估结果,以及基于实际测量利用 300 GHz 太赫兹波成像的成果。由于太赫兹波段可以获得超宽带频谱,因此可以在方位角、仰角和深度方向上进行几毫米分辨率的成像。我们通过测量到的高分辨率层析成像图展示了安全门应用的可行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Terahertz Sensing With CMOS-RFIC:Feasibility Verification for Short-Range Imaging Using 300-GHz MIMO Radar
For solving various social issues, sensing technology has gained significant interest. Terahertz waves, which combine the high resolution of light and transparency of radio waves, enable visualization of obstacles behind internal structures. So, it offers potential for new solutions. This letter introduces the overview of a short-distance sensing system based on the full digital MIMO radar concept, the design, and fundamental evaluation results of 300 GHz RFIC using CMOS technology, as well as the achievements of imaging using 300 GHz terahertz wave based on actual measurements. Since the terahertz band can obtain an ultrawideband spectrum, several millimeter resolution imaging can be performed in azimuth, elevation, and depth direction. We show the feasibility of the security gate application with the measured high-resolution tomographic images.
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来源期刊
IEEE Solid-State Circuits Letters
IEEE Solid-State Circuits Letters Engineering-Electrical and Electronic Engineering
CiteScore
4.30
自引率
3.70%
发文量
52
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