Aditya S. Dutt, Nithin B Pulumati, Kangfa Deng, Jens Wagner, Andreas Brönner, Frank Ellinger, Gabi Schierning, Kornelius Nielsch, Heiko Reith
{"title":"为物联网供电的高功率密度微型热电发生器","authors":"Aditya S. Dutt, Nithin B Pulumati, Kangfa Deng, Jens Wagner, Andreas Brönner, Frank Ellinger, Gabi Schierning, Kornelius Nielsch, Heiko Reith","doi":"10.1002/aelm.202400198","DOIUrl":null,"url":null,"abstract":"Micro thermoelectric generators (µTEGs) can harvest waste heat to generate electricity, making them a potential solution to the growing problem of powering autonomous electronics, such as sensors for the Internet of Things. Until now, µTEGs have not been able to provide power for these applications. This is because the output power of µTEGs is limited due to insufficient contacts and poor thermal coupling between the device and the heat source. In this work, the contact resistance as well as the thermal coupling between the heat source and the device through process optimization are improved. The former by improved electrochemical deposition (ECD) conditions, the latter by introducing a thin solder adhesion layer, which smooths the uneven surface of µTEG due to its good wetting properties. Using these improvements in combination with optimized packing density, here the fabrication and characterization of a µTEG with 126 leg pairs connected in series are reported that exhibits an open circuit voltage of 339.2 mV at a temperature difference of 20.6 K and a record-high normalized power density of 25.1 µW cm<sup>−2</sup> K<sup>−2</sup> for ECD based µTEGs. This µTEG is used to power a temperature sensor, bringing this work one step closer to application.","PeriodicalId":110,"journal":{"name":"Advanced Electronic Materials","volume":"4 1","pages":""},"PeriodicalIF":5.3000,"publicationDate":"2024-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High Power Density Micro Thermoelectric Generators for Powering IoTs\",\"authors\":\"Aditya S. Dutt, Nithin B Pulumati, Kangfa Deng, Jens Wagner, Andreas Brönner, Frank Ellinger, Gabi Schierning, Kornelius Nielsch, Heiko Reith\",\"doi\":\"10.1002/aelm.202400198\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Micro thermoelectric generators (µTEGs) can harvest waste heat to generate electricity, making them a potential solution to the growing problem of powering autonomous electronics, such as sensors for the Internet of Things. Until now, µTEGs have not been able to provide power for these applications. This is because the output power of µTEGs is limited due to insufficient contacts and poor thermal coupling between the device and the heat source. In this work, the contact resistance as well as the thermal coupling between the heat source and the device through process optimization are improved. The former by improved electrochemical deposition (ECD) conditions, the latter by introducing a thin solder adhesion layer, which smooths the uneven surface of µTEG due to its good wetting properties. Using these improvements in combination with optimized packing density, here the fabrication and characterization of a µTEG with 126 leg pairs connected in series are reported that exhibits an open circuit voltage of 339.2 mV at a temperature difference of 20.6 K and a record-high normalized power density of 25.1 µW cm<sup>−2</sup> K<sup>−2</sup> for ECD based µTEGs. This µTEG is used to power a temperature sensor, bringing this work one step closer to application.\",\"PeriodicalId\":110,\"journal\":{\"name\":\"Advanced Electronic Materials\",\"volume\":\"4 1\",\"pages\":\"\"},\"PeriodicalIF\":5.3000,\"publicationDate\":\"2024-11-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Electronic Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1002/aelm.202400198\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Electronic Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1002/aelm.202400198","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
High Power Density Micro Thermoelectric Generators for Powering IoTs
Micro thermoelectric generators (µTEGs) can harvest waste heat to generate electricity, making them a potential solution to the growing problem of powering autonomous electronics, such as sensors for the Internet of Things. Until now, µTEGs have not been able to provide power for these applications. This is because the output power of µTEGs is limited due to insufficient contacts and poor thermal coupling between the device and the heat source. In this work, the contact resistance as well as the thermal coupling between the heat source and the device through process optimization are improved. The former by improved electrochemical deposition (ECD) conditions, the latter by introducing a thin solder adhesion layer, which smooths the uneven surface of µTEG due to its good wetting properties. Using these improvements in combination with optimized packing density, here the fabrication and characterization of a µTEG with 126 leg pairs connected in series are reported that exhibits an open circuit voltage of 339.2 mV at a temperature difference of 20.6 K and a record-high normalized power density of 25.1 µW cm−2 K−2 for ECD based µTEGs. This µTEG is used to power a temperature sensor, bringing this work one step closer to application.
期刊介绍:
Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.