基于氧化石墨烯的具有人工突触可塑性的生物启发神经形态晶体管

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xinru Meng , Gexun Qin , Yanmei Sun
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引用次数: 0

摘要

当今社会,信息的爆炸式增长和人工智能的出现引发了人们对类脑计算设备的浓厚兴趣,因为它们具有独特的特性。基于晶体管的三端人工突触设备有望在神经计算领域克服当前冯-诺依曼架构的局限性。在这项研究中,我们提出了一种氧化石墨烯突触晶体管,它具有明显的双极特性,在 p 型器件中的阈值电压低至 -0.84 V。该器件展示了神经突触行为,为兴奋性突触后电流的存在及其对脉冲幅度和宽度的依赖性提供了证据。此外,还成功模拟了成对脉冲促进和抑制模型。研究观察到了尖峰电压依赖性可塑性,该装置在短期可塑性方面表现出良好的可重复性,包括短期延时和短期抑制。本研究展示了基于氧化石墨烯的突触晶体管的可行性,从而为神经计算领域开辟了新的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Graphene oxide-based bioinspired neuromorphic transistors with artificial synaptic plasticity
The explosive growth of information and the emergence of artificial intelligence have sparked significant interest in brain-like computing devices due to their unique properties in today's society. Transistor-based three-terminal artificial synaptic devices are anticipated to overcome the limitations of current von Neumann architectures in the realm of neural computing. In this study, we propose a graphene oxide synaptic transistor that demonstrates pronounced bipolar characteristics and exhibits a low threshold voltage of −0.84 V in p-type devices. The device demonstrates neurosynaptic behavior, providing evidence for the presence of excitatory postsynaptic current and its dependence on pulse amplitude and width. Furthermore, successful simulations have also been conducted to model paired-pulse facilitation and depression. The spike voltage-dependent plasticity was observed, and the device exhibited favorable repeatability in terms of short-term plasticity, encompassing both short-term potentiation and short-term depression. The present study showcases the viability of synaptic transistors based on graphene oxide, thereby opening up new avenues in the realm of neural computing.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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