通过缓冲区优化抑制单晶氮化铝模板上的氮化镓 HEMT 泄漏

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Junbo Wang;Xiangdong Li;Zhibo Cheng;Tao Zhang;Wenyong Zhou;Long Chen;Ye Yuan;Tongxin Lu;Lezhi Wang;Zilan Li;Shuzhen You;Xinqiang Wang;Yue Hao;Jincheng Zhang
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引用次数: 0

摘要

单晶氮化镓模板是氮化镓功率 HEMTs 的一种很有前景的基底选择,但很少有人对其进行研究。在这项工作中,成功演示并评估了 2 英寸氮化镓模板上的高性能氮化镓 HEMT。通过外延生长 AlN 成核层,使缓冲器/AlN 模板界面在二次外延过程中引入的 Si 和 O 杂质失活,缓冲器横向泄漏被显著抑制了五个数量级。没有任何场板结构的 HEMT 显示出超过 8 kV 的出色击穿电压和 10^{{9}}$ 的导通/关断比。动态$R_{\text{on}}$衰减限制在20%以内,阈值电压${V}_{\text {th}}$在关态应力后有10%的偏移。这项工作中展示的高性能 GaN HEMT 证明,单晶 AlN 模板有望用于未来的高可靠性功率 HEMT。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Suppressing the Leakage of GaN HEMTs on Single-Crystalline AlN Templates by Buffer Optimization
Single-crystalline AlN templates are a promising substrate choice for GaN power HEMTs, which have, however, seldom been investigated. In this work, high-performance GaN HEMTs on 2-in AlN templates are successfully demonstrated and evaluated. The buffer lateral leakage was significantly suppressed by five orders of magnitude by epitaxially growing an AlN nucleation layer to deactivate the impurities of Si and O, which are introduced at the interface of buffer/AlN template during the secondary epitaxy. An exceptionally high lateral blocking voltage exceeding 10 kV was attained with a spacing of $100~\mu $ m. HEMTs without any field plate structure showcase an outstanding breakdown voltage of over 8 kV and an on/off ratio of $10^{{9}}$ . The dynamic $R_{\text{on}}$ degradation is limited to be within 20%, and the threshold voltage ${V}_{\text {th}}$ exhibits a 10% shift after off-state stress. High-performance GaN HEMTs demonstrated in this work prove that the single-crystalline AlN templates are promising for future high-reliability power HEMTs.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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