低温环境下 AlGaN/GaN MIS-HEMT 结构的阈值电压稳定性

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yi-Ho Chen;Fu-Chuan Chu;M. Uma;Muhammad Aslam;Yao-Jen Lee;Yiming Li;Seiji Samukawa;Yeong-Her Wang
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引用次数: 0

摘要

本研究探讨了 AlGaN/GaN 肖特基栅极高电子迁移率晶体管 (HEMT) 和金属-绝缘体-半导体 HEMT (MIS-HEMT) 在低至 10 K 的低温下的电气行为。氧化物晶体管中众所周知的可靠性问题,如电流塌陷和阈值电压(${V}_{text {TH}}$ )变化,强调了此类研究的必要性。与肖特基栅极 HEMT 相比,MIS-HEMT 的 ${V}_{text {TH}}$ 变化更为明显,这归因于氧化物层中存在类似受体的缺陷态。MIS-HEMT 中的负 ${V}_{text {TH}}$ 变化可归因于电子的热离子发射减少。这些发现通过偏置温度不稳定性测试得到了验证。这些见解为低温环境下两种晶体管配置之间的性能差异提供了视角。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Threshold Voltage Stability in AlGaN/GaN MIS-HEMT Structure Under Cryogenic Environment
The electrical behavior of AlGaN/GaN Schottky-gate high-electron mobility transistors (HEMTs) and metal-insulator–semiconductor HEMTs (MIS-HEMTs) at cryogenic temperatures ranging down to 10 K is investi- gated in this research. The well-known reliability issues in oxide transistors, such as current collapse and threshold voltage ( ${V}_{\text {TH}}$ ) variations, emphasize the necessity of such studies. A more pronounced ${V}_{\text {TH}}$ variation in MIS-HEMTs compared to Schottky-gate HEMTs is observed, which is attributed to the presence of acceptor-like defect states within the oxide layer. The negative ${V}_{\text {TH}}$ shift in MIS-HEMTs can be ascribed to the reduced thermionic emission of electrons. These findings are validated through bias temp- erature instability tests. These insights offer perspectives on the performance differences between the two transistor configurations in cryogenic environments.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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