Madhusmita Sahoo , Kalyan Ghosh , Swayamprakash Sahoo , Pratap K. Sahoo , Tom Mathews , Sandip Dhara
{"title":"利用无损拉曼测温法测定相纯 10H-SiC 薄膜的热导率","authors":"Madhusmita Sahoo , Kalyan Ghosh , Swayamprakash Sahoo , Pratap K. Sahoo , Tom Mathews , Sandip Dhara","doi":"10.1016/j.tsf.2024.140536","DOIUrl":null,"url":null,"abstract":"<div><div>The 10 H SiC thin films are potential candidates for devices that can be used in high temperature and high radiation environment. Measurement of thermal conductivity of thin films by a non-invasive method is very useful for such device fabrication. Micro-Raman method serves as an important tool in this aspect and is known as Raman thermometry. It utilises a steady-state heat transfer model in a semi-infinite half space and provides for an effective technique to measure thermal conductivity of films as a function of film thickness and laser spot size. This method has two limiting conditions i.e. thick film limit and thin film limit. The limiting conditions of this model was explored by simulating the model for different film thicknesses at constant laser spot size. 10H SiC films of three different thicknesses i.e. 104, 135 and 156 nm were chosen to validate the thin film limiting condition. Thermal conductivity of these thin films varied from 0.60 – 4.80 <span><math><mrow><mo>(</mo><msup><mrow><mi>Wm</mi></mrow><mrow><mo>−</mo><mn>1</mn></mrow></msup><msup><mrow><mi>K</mi></mrow><mrow><mo>−</mo><mn>1</mn></mrow></msup><mo>)</mo></mrow></math></span>.</div></div>","PeriodicalId":23182,"journal":{"name":"Thin Solid Films","volume":"807 ","pages":"Article 140536"},"PeriodicalIF":2.0000,"publicationDate":"2024-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Determination of thermal conductivity of phase pure 10H-SiC thin films by non-destructive Raman thermometry\",\"authors\":\"Madhusmita Sahoo , Kalyan Ghosh , Swayamprakash Sahoo , Pratap K. Sahoo , Tom Mathews , Sandip Dhara\",\"doi\":\"10.1016/j.tsf.2024.140536\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The 10 H SiC thin films are potential candidates for devices that can be used in high temperature and high radiation environment. Measurement of thermal conductivity of thin films by a non-invasive method is very useful for such device fabrication. Micro-Raman method serves as an important tool in this aspect and is known as Raman thermometry. It utilises a steady-state heat transfer model in a semi-infinite half space and provides for an effective technique to measure thermal conductivity of films as a function of film thickness and laser spot size. This method has two limiting conditions i.e. thick film limit and thin film limit. The limiting conditions of this model was explored by simulating the model for different film thicknesses at constant laser spot size. 10H SiC films of three different thicknesses i.e. 104, 135 and 156 nm were chosen to validate the thin film limiting condition. Thermal conductivity of these thin films varied from 0.60 – 4.80 <span><math><mrow><mo>(</mo><msup><mrow><mi>Wm</mi></mrow><mrow><mo>−</mo><mn>1</mn></mrow></msup><msup><mrow><mi>K</mi></mrow><mrow><mo>−</mo><mn>1</mn></mrow></msup><mo>)</mo></mrow></math></span>.</div></div>\",\"PeriodicalId\":23182,\"journal\":{\"name\":\"Thin Solid Films\",\"volume\":\"807 \",\"pages\":\"Article 140536\"},\"PeriodicalIF\":2.0000,\"publicationDate\":\"2024-09-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Thin Solid Films\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0040609024003377\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, COATINGS & FILMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thin Solid Films","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0040609024003377","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}
引用次数: 0
摘要
10 H SiC 薄膜是可用于高温和高辐射环境的设备的潜在候选材料。采用非侵入式方法测量薄膜的热导率对此类设备的制造非常有用。微拉曼法是这方面的重要工具,被称为拉曼测温法。它利用半无限半空间中的稳态传热模型,提供了一种测量薄膜热导率的有效技术,它是薄膜厚度和激光光斑大小的函数。这种方法有两个极限条件,即厚膜极限和薄膜极限。通过在激光光斑尺寸恒定的情况下模拟不同厚度的薄膜,探索了该模型的极限条件。我们选择了 104、135 和 156 nm 三种不同厚度的 10H SiC 薄膜来验证薄膜极限条件。这些薄膜的热导率在 0.60 - 4.80 (Wm-1K-1) 之间变化。
Determination of thermal conductivity of phase pure 10H-SiC thin films by non-destructive Raman thermometry
The 10 H SiC thin films are potential candidates for devices that can be used in high temperature and high radiation environment. Measurement of thermal conductivity of thin films by a non-invasive method is very useful for such device fabrication. Micro-Raman method serves as an important tool in this aspect and is known as Raman thermometry. It utilises a steady-state heat transfer model in a semi-infinite half space and provides for an effective technique to measure thermal conductivity of films as a function of film thickness and laser spot size. This method has two limiting conditions i.e. thick film limit and thin film limit. The limiting conditions of this model was explored by simulating the model for different film thicknesses at constant laser spot size. 10H SiC films of three different thicknesses i.e. 104, 135 and 156 nm were chosen to validate the thin film limiting condition. Thermal conductivity of these thin films varied from 0.60 – 4.80 .
期刊介绍:
Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.