射频集成电路磁集成电感器的进展与展望

Weiquan Hao;Xunyu Li;Zijin Pan;Runyu Miao;Zijian Yue;Chen Yang;Albert Z. Wang
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摘要

本文回顾了射频(RF)集成电路(IC)磁集成电感器的开发进展。磁性集成是减少片上电感器占位面积的一种有前途的方法,而占位面积是实现工作频率在千兆赫及以上的紧凑型射频集成电路片上系统(SoC)的主要障碍。在过去二十年中,研究人员开发了许多铁磁(FM)或铁氧体薄膜、层压材料和纳米颗粒复合材料,通过优化材料成分、结构和电阻率、器件设计、制造工艺和集成方法,克服了材料的频率限制,从而将电感器的频率提高到 GHz 范围。本文首先回顾了 GHz 电感器应用所需的关键材料特性,然后介绍了已演示的磁性集成片上电感器的结果。论文总结了材料和器件的结构设计、制造工艺以及报告的磁性电感器器件性能。重点介绍了在 CMOS 中使用堆叠磁芯的独特、非传统垂直射频电感器。讨论了使用磁性集成电感器和新兴 GHz 可调电感器的射频集成电路设计实例。概述了紧凑型多 GHz 磁集成电感器的未来前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Advances and Perspectives in Magnetic-Integrated Inductors for RF ICs
This paper reviews advances in developing magnetic-integrated inductors for radio-frequency (RF) integrated circuits (IC). Magnetic integration is a promising way to reduce the footprint of on-chip inductors, which is the main roadblock towards realizing compact RF IC systems-on-a-chip (SoC) operating at GHz and beyond. In the past two decades, researchers have developed many ferromagnetic (FM) or ferrite thin films, laminations, and nanoparticle composites to overcome the frequency limit of the materials, hence, inductors, to GHz range by optimizing materials composition, structure and resistivity, device design, fabrication process, and integration method. The paper starts with reviewing key materials properties required for GHz inductor applications, followed by results of demonstrated magnetic-integrated on-chip inductors. The structural designs of materials and devices, fabrication processes, and the reported device performances of magnetic inductors are summarized. A unique, non-traditional vertical RF inductor with stacked-via magnetic core in CMOS is highlighted. RF IC design examples using magnetic-integrated inductors and emerging GHz tunable inductors are discussed. Future perspectives for compact, multiple-GHz magnetic-integrated inductors are outlined.
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