Jiacheng Zhou, Jinglin Shi, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu, Huijun He
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Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.</p><!--/ Abstract__block -->\n<h3>Findings</h3>\n<p>When the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. These particles acted as a diffusion barrier, impeding the growth of the IMC layer at the interface. The growth of the Cu<sub>3</sub>Sn layer during the aging process was strongly correlated with the presence of In. The growth rate of the Cu<sub>3</sub>Sn layer was significantly reduced when the In concentration exceeded 3 Wt.%.</p><!--/ Abstract__block -->\n<h3>Originality/value</h3>\n<p>The addition of In promotes the formation of InSb particles in Sn-3Ag-3Sb-xIn/Cu solder joints. 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This paper aims to investigate the growth behavior of the interfacial IMC layer during isothermal aging at 125°C for Sn-3Ag-3Sb-xIn/Cu (<em>x</em> = 0, 1, 2, 3, 4, 5 Wt.%) solder joints with different In contents and commercial Sn-3Ag-0.5Cu/Cu solder joints.</p><!--/ Abstract__block -->\\n<h3>Design/methodology/approach</h3>\\n<p>In this paper, Sn-3Ag-3Sb-xIn/Cu (<em>x</em> = 0, 1, 2, 3, 4, 5 Wt.%) and commercial Sn-3Ag-0.5Cu/Cu solder were prepared for bonding Cu substrate. Then these samples were subjected to isothermal aging for 0, 2, 8, 14, 25 and 45 days. Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>When the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. 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Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate
Purpose
The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth behavior of the interfacial IMC layer during isothermal aging at 125°C for Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) solder joints with different In contents and commercial Sn-3Ag-0.5Cu/Cu solder joints.
Design/methodology/approach
In this paper, Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) and commercial Sn-3Ag-0.5Cu/Cu solder were prepared for bonding Cu substrate. Then these samples were subjected to isothermal aging for 0, 2, 8, 14, 25 and 45 days. Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.
Findings
When the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. These particles acted as a diffusion barrier, impeding the growth of the IMC layer at the interface. The growth of the Cu3Sn layer during the aging process was strongly correlated with the presence of In. The growth rate of the Cu3Sn layer was significantly reduced when the In concentration exceeded 3 Wt.%.
Originality/value
The addition of In promotes the formation of InSb particles in Sn-3Ag-3Sb-xIn/Cu solder joints. These particles limit the growth of the total IMC layer, while a higher In content also slows the growth of the Cu3Sn layer. This study is significant for designing alloy compositions for new high-reliability solders.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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