{"title":"抑制漏极引起的动态阈值电压不稳定性的 p-GaN/MIS 门混合 HEMT","authors":"Chen Wang;Jinyan Wang;Xin Wang;Ziheng Liu;Jiayin He;Ju Gao;Chengkang Ao;Maojun Wang;Jin Wei","doi":"10.1109/LED.2024.3448362","DOIUrl":null,"url":null,"abstract":"This letter demonstrates a hybrid p-GaN/MIS gate HEMT (HG-HEMT) to suppress the drain-induced dynamic threshold voltage (\n<inline-formula> <tex-math>${V}_{\\text {th}}\\text {)}$ </tex-math></inline-formula>\n instability. By implementing a depletion-mode (D-mode) MIS gate adjacent to Schottky-type p-GaN gate, the drain-induced bidirectional shift of dynamic \n<inline-formula> <tex-math>${V}_{\\text {th}}$ </tex-math></inline-formula>\n is significantly reduced. The fabricated HG-HEMT exhibits decent performances compared to the conventional Schottky-type p-GaN gate HEMT (Conv-HEMT), with saturation current (\n<inline-formula> <tex-math>${I}_{\\text {D, {sat}}}\\text {)}$ </tex-math></inline-formula>\n of 345 mA/mm, on-resistance (\n<inline-formula> <tex-math>${R}_{\\text {ON}}\\text {)}$ </tex-math></inline-formula>\n of \n<inline-formula> <tex-math>$13.2~\\Omega \\cdot $ </tex-math></inline-formula>\n mm, and hard breakdown voltage (\n<italic>BV</i>\n) of 1315 V, which are similar to the Conv-HEMT. The HG-HEMT demonstrates significantly improved dynamic \n<inline-formula> <tex-math>${V}_{\\text {th}}$ </tex-math></inline-formula>\n stability under drain bias, with a negligible dynamic \n<inline-formula> <tex-math>${V}_{\\text {th}}$ </tex-math></inline-formula>\n shift at on-state drain bias of 50 V, and a small positive dynamic \n<inline-formula> <tex-math>${V}_{\\text {th}}$ </tex-math></inline-formula>\n shift of +0.05 V after off-state drain bias of 400 V. As a comparison, \n<inline-formula> <tex-math>${V}_{\\text {th}}$ </tex-math></inline-formula>\n shifts of the Conv-HEMT are −0.28 V and +0.42 V, respectively. The improved dynamic \n<inline-formula> <tex-math>${V}_{\\text {th}}$ </tex-math></inline-formula>\n stability of the HG-HEMT is owing to a D-mode MIS-gate region that shields the interplay between drain and the p-GaN region. The proposed HG-HEMT paves the way for highly stable GaN power electronics applications.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"45 10","pages":"1732-1735"},"PeriodicalIF":4.1000,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Hybrid p-GaN/MIS Gate HEMT Suppressing Drain-Induced Dynamic Threshold Voltage Instability\",\"authors\":\"Chen Wang;Jinyan Wang;Xin Wang;Ziheng Liu;Jiayin He;Ju Gao;Chengkang Ao;Maojun Wang;Jin Wei\",\"doi\":\"10.1109/LED.2024.3448362\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This letter demonstrates a hybrid p-GaN/MIS gate HEMT (HG-HEMT) to suppress the drain-induced dynamic threshold voltage (\\n<inline-formula> <tex-math>${V}_{\\\\text {th}}\\\\text {)}$ </tex-math></inline-formula>\\n instability. By implementing a depletion-mode (D-mode) MIS gate adjacent to Schottky-type p-GaN gate, the drain-induced bidirectional shift of dynamic \\n<inline-formula> <tex-math>${V}_{\\\\text {th}}$ </tex-math></inline-formula>\\n is significantly reduced. The fabricated HG-HEMT exhibits decent performances compared to the conventional Schottky-type p-GaN gate HEMT (Conv-HEMT), with saturation current (\\n<inline-formula> <tex-math>${I}_{\\\\text {D, {sat}}}\\\\text {)}$ </tex-math></inline-formula>\\n of 345 mA/mm, on-resistance (\\n<inline-formula> <tex-math>${R}_{\\\\text {ON}}\\\\text {)}$ </tex-math></inline-formula>\\n of \\n<inline-formula> <tex-math>$13.2~\\\\Omega \\\\cdot $ </tex-math></inline-formula>\\n mm, and hard breakdown voltage (\\n<italic>BV</i>\\n) of 1315 V, which are similar to the Conv-HEMT. The HG-HEMT demonstrates significantly improved dynamic \\n<inline-formula> <tex-math>${V}_{\\\\text {th}}$ </tex-math></inline-formula>\\n stability under drain bias, with a negligible dynamic \\n<inline-formula> <tex-math>${V}_{\\\\text {th}}$ </tex-math></inline-formula>\\n shift at on-state drain bias of 50 V, and a small positive dynamic \\n<inline-formula> <tex-math>${V}_{\\\\text {th}}$ </tex-math></inline-formula>\\n shift of +0.05 V after off-state drain bias of 400 V. As a comparison, \\n<inline-formula> <tex-math>${V}_{\\\\text {th}}$ </tex-math></inline-formula>\\n shifts of the Conv-HEMT are −0.28 V and +0.42 V, respectively. The improved dynamic \\n<inline-formula> <tex-math>${V}_{\\\\text {th}}$ </tex-math></inline-formula>\\n stability of the HG-HEMT is owing to a D-mode MIS-gate region that shields the interplay between drain and the p-GaN region. The proposed HG-HEMT paves the way for highly stable GaN power electronics applications.\",\"PeriodicalId\":13198,\"journal\":{\"name\":\"IEEE Electron Device Letters\",\"volume\":\"45 10\",\"pages\":\"1732-1735\"},\"PeriodicalIF\":4.1000,\"publicationDate\":\"2024-08-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Electron Device Letters\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10644097/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10644097/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Hybrid p-GaN/MIS Gate HEMT Suppressing Drain-Induced Dynamic Threshold Voltage Instability
This letter demonstrates a hybrid p-GaN/MIS gate HEMT (HG-HEMT) to suppress the drain-induced dynamic threshold voltage (
${V}_{\text {th}}\text {)}$
instability. By implementing a depletion-mode (D-mode) MIS gate adjacent to Schottky-type p-GaN gate, the drain-induced bidirectional shift of dynamic
${V}_{\text {th}}$
is significantly reduced. The fabricated HG-HEMT exhibits decent performances compared to the conventional Schottky-type p-GaN gate HEMT (Conv-HEMT), with saturation current (
${I}_{\text {D, {sat}}}\text {)}$
of 345 mA/mm, on-resistance (
${R}_{\text {ON}}\text {)}$
of
$13.2~\Omega \cdot $
mm, and hard breakdown voltage (
BV
) of 1315 V, which are similar to the Conv-HEMT. The HG-HEMT demonstrates significantly improved dynamic
${V}_{\text {th}}$
stability under drain bias, with a negligible dynamic
${V}_{\text {th}}$
shift at on-state drain bias of 50 V, and a small positive dynamic
${V}_{\text {th}}$
shift of +0.05 V after off-state drain bias of 400 V. As a comparison,
${V}_{\text {th}}$
shifts of the Conv-HEMT are −0.28 V and +0.42 V, respectively. The improved dynamic
${V}_{\text {th}}$
stability of the HG-HEMT is owing to a D-mode MIS-gate region that shields the interplay between drain and the p-GaN region. The proposed HG-HEMT paves the way for highly stable GaN power electronics applications.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.