采用单栅极 S imple 工艺的三维自对齐叠层 Ge 纳米线互补场效应晶体管

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yi-Wen Lin;Bo-An Chen;Kai-Wei Huang;Bo-Xu Chen;Guang-Li Luo;Yung-Chun Wu;Fu-Ju Hou
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引用次数: 0

摘要

在这项研究中,我们通过实验展示了一种最先进的三维(3-D)自对准堆叠异取向 p 型 Ge 矩形纳米线(NW)栅全包围场效应晶体管(GAAFET),它位于单栅互补场效应晶体管(CFET)的 n 型 Ge 金刚石 NW GAAFET 上。采用各向异性和各向同性的干法蚀刻工艺来形成叠层 NW。使用 Ge 作为沟道材料,其最佳表面取向为金刚石 NW nFET 的 (111) 和矩形 NW pFET 的 (110),可以提高器件性能。三维 TCAD 仿真表明,1 纳米节点应用中的 CFET 器件性能更优。所提出的 CFET 结构可以简化制造技术,并与当前的 CMOS 技术平台完全兼容。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
3-D Self-Aligned Stacked Ge Nanowires Complementary FET Featuring Single Gate Simple Process
In this study, we experimentally demonstrated a state-of-the-art three-dimensional (3-D) self-aligned stacked hetero-oriented p-type Ge rectangle nanowire (NW) gate-all-around field-effect transistor (GAAFET) on n-type Ge diamond NW GAAFET of single-gate complementary FET (CFET). Anisotropic and isotropic dry etching processes are used to form the stacked NWs. Using Ge as the channel material with its optimal surface orientations of (111) for diamond NW nFET and (110) for rectangle NW pFET can enhance the device performance. The 3-D TCAD simulation indicates outperformance of the CFET device for 1-nm node applications. The proposed CFET structure can simplify the manufacturing technology and be fully compatible with current CMOS technology platform.
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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