{"title":"使用 BN@C 混合填料增强聚合物复合材料的热导率","authors":"Xuang Bai, Yuhang Meng, Fanyu Zhou, Cong Ge, Dandan Sun, Dehong Yang, Xiangfen Jiang, Pengcheng Dai, Xuebin Wang","doi":"10.1039/d4tc02766c","DOIUrl":null,"url":null,"abstract":"The issue of heat accumulation caused by the low thermal conductivity (TC) of polymers widely used in electronic devices has become a block for chip development. Enhancing the overall TC by adding high-TC fillers to polymers to create composites is considered one of the promising solutions. However, adding a single filler to the polymer may lead to issues such as high interfacial thermal resistance between fillers. Here, we developed a boron nitride@carbon particle (BN@C) hybrid filler by <em>in situ</em> growth of carbon particles on the surface of BN and constructed BN@C/epoxy composites. The presence of carbon bridged the BN and prevented its agglomeration, forming a smooth and efficient thermal conduction network. Consequently, the TC of the composite reached 1.69 W m<small><sup>−1</sup></small> K<small><sup>−1</sup></small> at a 60 wt% load. Additionally, it exhibited excellent thermal stability, mechanical and dielectrical properties, and breakdown strength. This study provides an effective strategy for manufacturing high-TC polymeric composites for electronic devices.","PeriodicalId":84,"journal":{"name":"Journal of Materials Chemistry C","volume":null,"pages":null},"PeriodicalIF":5.7000,"publicationDate":"2024-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enhanced thermal conductivity of polymeric composites with BN@C hybrid fillers\",\"authors\":\"Xuang Bai, Yuhang Meng, Fanyu Zhou, Cong Ge, Dandan Sun, Dehong Yang, Xiangfen Jiang, Pengcheng Dai, Xuebin Wang\",\"doi\":\"10.1039/d4tc02766c\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The issue of heat accumulation caused by the low thermal conductivity (TC) of polymers widely used in electronic devices has become a block for chip development. Enhancing the overall TC by adding high-TC fillers to polymers to create composites is considered one of the promising solutions. However, adding a single filler to the polymer may lead to issues such as high interfacial thermal resistance between fillers. Here, we developed a boron nitride@carbon particle (BN@C) hybrid filler by <em>in situ</em> growth of carbon particles on the surface of BN and constructed BN@C/epoxy composites. The presence of carbon bridged the BN and prevented its agglomeration, forming a smooth and efficient thermal conduction network. Consequently, the TC of the composite reached 1.69 W m<small><sup>−1</sup></small> K<small><sup>−1</sup></small> at a 60 wt% load. Additionally, it exhibited excellent thermal stability, mechanical and dielectrical properties, and breakdown strength. This study provides an effective strategy for manufacturing high-TC polymeric composites for electronic devices.\",\"PeriodicalId\":84,\"journal\":{\"name\":\"Journal of Materials Chemistry C\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":5.7000,\"publicationDate\":\"2024-08-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Chemistry C\",\"FirstCategoryId\":\"1\",\"ListUrlMain\":\"https://doi.org/10.1039/d4tc02766c\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Chemistry C","FirstCategoryId":"1","ListUrlMain":"https://doi.org/10.1039/d4tc02766c","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Enhanced thermal conductivity of polymeric composites with BN@C hybrid fillers
The issue of heat accumulation caused by the low thermal conductivity (TC) of polymers widely used in electronic devices has become a block for chip development. Enhancing the overall TC by adding high-TC fillers to polymers to create composites is considered one of the promising solutions. However, adding a single filler to the polymer may lead to issues such as high interfacial thermal resistance between fillers. Here, we developed a boron nitride@carbon particle (BN@C) hybrid filler by in situ growth of carbon particles on the surface of BN and constructed BN@C/epoxy composites. The presence of carbon bridged the BN and prevented its agglomeration, forming a smooth and efficient thermal conduction network. Consequently, the TC of the composite reached 1.69 W m−1 K−1 at a 60 wt% load. Additionally, it exhibited excellent thermal stability, mechanical and dielectrical properties, and breakdown strength. This study provides an effective strategy for manufacturing high-TC polymeric composites for electronic devices.
期刊介绍:
The Journal of Materials Chemistry is divided into three distinct sections, A, B, and C, each catering to specific applications of the materials under study:
Journal of Materials Chemistry A focuses primarily on materials intended for applications in energy and sustainability.
Journal of Materials Chemistry B specializes in materials designed for applications in biology and medicine.
Journal of Materials Chemistry C is dedicated to materials suitable for applications in optical, magnetic, and electronic devices.
Example topic areas within the scope of Journal of Materials Chemistry C are listed below. This list is neither exhaustive nor exclusive.
Bioelectronics
Conductors
Detectors
Dielectrics
Displays
Ferroelectrics
Lasers
LEDs
Lighting
Liquid crystals
Memory
Metamaterials
Multiferroics
Photonics
Photovoltaics
Semiconductors
Sensors
Single molecule conductors
Spintronics
Superconductors
Thermoelectrics
Topological insulators
Transistors