组专属特征组套索及其在半导体制造虚拟计量自动传感器选择中的应用

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jeongsub Choi;Youngdoo Son;Jihoon Kang
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引用次数: 0

摘要

组 lasso 是一种正则化方法,广泛应用于机器学习中的组级稀疏性特征组选择。然而,使用组 lasso 正则化训练模型会导致选择所有彼此密切相关的组,尽管这些组的特征对预测目标非常有用。在本研究中,我们提出了一种新的正则化方法--组排他性组 lasso,用于自动选择排他性特征组。所提出的正则化旨在加强组间水平的排他性稀疏性,阻止重合选择具有组级相关性且对目标具有共同预测能力的特征组。所提出的方法旨在实现更高的组稀疏性,只选择突出的特征组,并将其应用于神经网络。我们在合成数据集和半导体制造中自动选择传感器的虚拟计量实际案例中评估了神经网络中的正则化建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Group-Exclusive Feature Group Lasso and Applications to Automatic Sensor Selection for Virtual Metrology in Semiconductor Manufacturing
Group lasso is a regularization widely used for feature group selection with sparsity at a group level in machine learning. Training a model with the group lasso regularization, however, leads to the selection of all the groups together that are closely related to each other although their features are useful to predict a target. In this study, we propose a new regularization, group-exclusive group lasso, for automatic exclusive feature group selection. The proposed regularization aims to enforce exclusive sparsity at an inter-group level, discouraging the coincident selection of the feature groups that are group-level correlated and share predictive powers toward the targets. The proposed method aims at higher group sparsity for selecting salient feature groups only, and is applied to neural networks. We evaluate the proposed regularization in neural networks on synthetic datasets and a real-life case for virtual metrology with automatic sensor selection in semiconductor manufacturing.
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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