{"title":"扩展肖特基 p-GaN 栅极 HEMT 的静电建模:对氮化镓的均匀掺杂和工程掺杂","authors":"Mojtaba Alaei;Matteo Borga;Elena Fabris;Stefaan Decoutere;Johan Lauwaert;Benoit Bakeroot","doi":"10.1109/TED.2024.3446488","DOIUrl":null,"url":null,"abstract":"This article presents a comprehensive analytical framework for modeling p-GaN gate high-electronmobility transistors (HEMTs) based on rigorous solution of the Poisson and Schrödinger equations. It focuses primarily on the calculation of the 2-D electron gas (2DEG), voltage variation across the junction (\n<inline-formula> <tex-math>$\\Delta V_j$ </tex-math></inline-formula>\n), and AIGaN barrier (\n<inline-formula> <tex-math>$\\Delta V_b$ </tex-math></inline-formula>\n) for the entire range of forward gate bias until gate breakdown. Our model considers the impact of AIGaN barrier height saturation. In addition, we demonstrate our model with the engineered p-GaN doping profile that yields higher forward gate breakdown voltages. Gate capacitance and breakdown voltage have been modeled for both uniform and engineered p-GaN doping profiles. The viability and accuracy of the proposed model are demonstrated through comparisons with empirical measurement data and TCAD simulations.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10648585","citationCount":"0","resultStr":"{\"title\":\"Extending Electrostatic Modeling for Schottky p-GaN Gate HEMTs: Uniform and Engineered p-GaN Doping\",\"authors\":\"Mojtaba Alaei;Matteo Borga;Elena Fabris;Stefaan Decoutere;Johan Lauwaert;Benoit Bakeroot\",\"doi\":\"10.1109/TED.2024.3446488\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article presents a comprehensive analytical framework for modeling p-GaN gate high-electronmobility transistors (HEMTs) based on rigorous solution of the Poisson and Schrödinger equations. It focuses primarily on the calculation of the 2-D electron gas (2DEG), voltage variation across the junction (\\n<inline-formula> <tex-math>$\\\\Delta V_j$ </tex-math></inline-formula>\\n), and AIGaN barrier (\\n<inline-formula> <tex-math>$\\\\Delta V_b$ </tex-math></inline-formula>\\n) for the entire range of forward gate bias until gate breakdown. Our model considers the impact of AIGaN barrier height saturation. In addition, we demonstrate our model with the engineered p-GaN doping profile that yields higher forward gate breakdown voltages. Gate capacitance and breakdown voltage have been modeled for both uniform and engineered p-GaN doping profiles. The viability and accuracy of the proposed model are demonstrated through comparisons with empirical measurement data and TCAD simulations.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-08-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10648585\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10648585/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10648585/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Extending Electrostatic Modeling for Schottky p-GaN Gate HEMTs: Uniform and Engineered p-GaN Doping
This article presents a comprehensive analytical framework for modeling p-GaN gate high-electronmobility transistors (HEMTs) based on rigorous solution of the Poisson and Schrödinger equations. It focuses primarily on the calculation of the 2-D electron gas (2DEG), voltage variation across the junction (
$\Delta V_j$
), and AIGaN barrier (
$\Delta V_b$
) for the entire range of forward gate bias until gate breakdown. Our model considers the impact of AIGaN barrier height saturation. In addition, we demonstrate our model with the engineered p-GaN doping profile that yields higher forward gate breakdown voltages. Gate capacitance and breakdown voltage have been modeled for both uniform and engineered p-GaN doping profiles. The viability and accuracy of the proposed model are demonstrated through comparisons with empirical measurement data and TCAD simulations.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.