扩展肖特基 p-GaN 栅极 HEMT 的静电建模:对氮化镓的均匀掺杂和工程掺杂

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Mojtaba Alaei;Matteo Borga;Elena Fabris;Stefaan Decoutere;Johan Lauwaert;Benoit Bakeroot
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引用次数: 0

摘要

本文基于对泊松方程和薛定谔方程的严格求解,提出了对氮化镓栅高电子迁移率晶体管(HEMT)建模的综合分析框架。它主要侧重于计算二维电子气体(2DEG)、结点电压变化($\Delta V_j$)和氮化镓势垒($\Delta V_b$)在整个正向栅极偏压范围内直至栅极击穿的情况。我们的模型考虑了 AIGaN 势垒高度饱和的影响。此外,我们还利用工程设计的 p-GaN 掺杂曲线演示了我们的模型,该曲线能产生更高的正向栅极击穿电压。对均匀和工程 p-GaN 掺杂曲线的栅极电容和击穿电压都进行了建模。通过与经验测量数据和 TCAD 仿真的比较,证明了所提模型的可行性和准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Extending Electrostatic Modeling for Schottky p-GaN Gate HEMTs: Uniform and Engineered p-GaN Doping
This article presents a comprehensive analytical framework for modeling p-GaN gate high-electronmobility transistors (HEMTs) based on rigorous solution of the Poisson and Schrödinger equations. It focuses primarily on the calculation of the 2-D electron gas (2DEG), voltage variation across the junction ( $\Delta V_j$ ), and AIGaN barrier ( $\Delta V_b$ ) for the entire range of forward gate bias until gate breakdown. Our model considers the impact of AIGaN barrier height saturation. In addition, we demonstrate our model with the engineered p-GaN doping profile that yields higher forward gate breakdown voltages. Gate capacitance and breakdown voltage have been modeled for both uniform and engineered p-GaN doping profiles. The viability and accuracy of the proposed model are demonstrated through comparisons with empirical measurement data and TCAD simulations.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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