激光焊接过程中不同光束距离的影响:数值和实验研究

IF 1.7 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Muhammad Zaim Hanif Nazarudin, Mohamad Aizat Abas, Wan Maryam Wan Ahmad Kamil, Faiz Farhan Ahmad Nadzri, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani, Mohd Hafiz Zawawi
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引用次数: 0

摘要

目的 本文旨在通过了解激光束对焊点质量的影响,研究不同光束距离的效果。利用基于数值的模拟和实验验证,将有助于最大限度地减少 PTH 中可能导致无源器件出现裂纹和缺陷的微小空隙的形成。 设计/方法/途径 该研究采用基于数值的有限体积法(FVM)模拟和实验验证相结合的方法,探索不同激光束距离对 PTH 组装中焊点质量的影响。研究对焊料流动进行了可视化,并确定了放置焊接工件的最佳光束距离以及插入焊锡丝的合适公差距离。实验结果表明,99.0 毫米距离处的激光束聚焦点产生的光束尺寸最小。模拟可视化结果表明,激光束的汇聚区位于离聚焦点 +4.6 毫米处,这为放置焊锡丝提供了最佳公差距离。高功率激光二极管在距离聚焦点 103.6 毫米处显示出最大公差距离,该处适合使用 50%的激光功率来定位焊接工件。模拟结果符合 IPC-A-610 标准,确保了最佳填充高度、接触角为 90° 的圆角形状和无缺陷。光束距离和功率水平等参数为改进制造业的激光焊接工艺提供了实用指南。原创性/价值这项研究将高功率激光二极管技术与基于数值的模拟相结合,优化了光束距离参数,从而最大限度地减少了 PTH 区域的微空洞形成,为该领域做出了贡献。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of different beam distances in laser soldering process: a numerical and experimental study

Purpose

This paper aims to investigate the effect of different beam distance by understanding laser beam influence on solder joint quality. The utilisation numerical-based simulations and experimental validation will help to minimise the formation of micro void in PTH that can lead to cracks and defects on passive devices.

Design/methodology/approach

The research uses a combination approach of numerical-based simulation using Finite Volume Method (FVM) and experimental validation to explore the impact of different laser beam distances on solder joint quality in PTH assemblies. The study visualises solder flow and identifies the optimal beam distance for placing a soldering workpiece and a suitable tolerance distance for inserting the solder wire.

Findings

The simulation results show the formation of micro void that occurs in PTH region with low volume fraction and unbalance heat concentration profile observed. The experimental results indicate that the focus point of the laser beam at a 99.0 mm distance yields the smallest beam size. Simulation visualisation demonstrates that the laser beam’s converging area at +4.6 mm from the focus point which provides optimal tolerance distances for placing the solder wire. The high-power laser diode exhibits maximum tolerance distance at 103.6 mm from the focus point where suitable beam distance for positioning of the soldering workpiece with 50% laser power. The simulation results align with the IPC-A-610 standard, ensuring optimal filling height, fillet shape with a 90° contact angle and defect-free.

Practical implications

This research provides implications for the industry by demonstrating the capability of the simulation approach to produce high-quality solder joints. The parameters, such as beam distance and power levels, offer practical guidelines for improving laser soldering processes in the manufacturing industry.

Originality/value

This study contributes to the field by combining high-power laser diode technology with numerical-based simulations to optimise the beam distance parameters for minimising micro void formation in the PTH region.

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来源期刊
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 工程技术-材料科学:综合
CiteScore
4.10
自引率
15.00%
发文量
30
审稿时长
>12 weeks
期刊介绍: Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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