{"title":"利用激光加热在锡/铜和锡-0.1AlN/铜结构中形成 Cu6Sn5 薄膜及其生长机制","authors":"Zhang Liang","doi":"10.1108/ssmt-05-2023-0021","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints.</p><!--/ Abstract__block -->\n<h3>Design/methodology/approach</h3>\n<p>This study investigates the Sn/Cu and Sn-0.1AlN/Cu structure using laser soldering under different laser power: (200, 225 and 250 W) and heating time: (2, 3 and 4 s).</p><!--/ Abstract__block -->\n<h3>Findings</h3>\n<p>The results show clearly that the formation of nano-Cu<sub>6</sub>Sn<sub>5</sub> films is feasible in the laser heating (200 W and 2 s) with Sn/Cu and Sn-0.1AlN/Cu system. The nano-Cu<sub>6</sub>Sn<sub>5</sub> films with thickness of 500 nm and grains with 700 nm are generally parallel to the Cu surface with Sn-0.1AlN. Both IMC films thickness of Sn/Cu and Sn-0.1AlN/Cu solder joints gradually increased from 524.2 to 2025.8 nm as the laser heating time and the laser power extended. Nevertheless, doping AlN nanoparticles can slow down the growth rate of Cu<sub>6</sub>Sn<sub>5</sub> films in Sn solder joints due to its adsorption.</p><!--/ Abstract__block -->\n<h3>Originality/value</h3>\n<p>The formation of nano-Cu<sub>6</sub>Sn<sub>5</sub> films using laser heating can provide a new method for nanofilm development to realize the metallurgical interconnection in electronic packaging.</p><!--/ Abstract__block -->","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":"27 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating\",\"authors\":\"Zhang Liang\",\"doi\":\"10.1108/ssmt-05-2023-0021\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3>Purpose</h3>\\n<p>The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints.</p><!--/ Abstract__block -->\\n<h3>Design/methodology/approach</h3>\\n<p>This study investigates the Sn/Cu and Sn-0.1AlN/Cu structure using laser soldering under different laser power: (200, 225 and 250 W) and heating time: (2, 3 and 4 s).</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>The results show clearly that the formation of nano-Cu<sub>6</sub>Sn<sub>5</sub> films is feasible in the laser heating (200 W and 2 s) with Sn/Cu and Sn-0.1AlN/Cu system. The nano-Cu<sub>6</sub>Sn<sub>5</sub> films with thickness of 500 nm and grains with 700 nm are generally parallel to the Cu surface with Sn-0.1AlN. Both IMC films thickness of Sn/Cu and Sn-0.1AlN/Cu solder joints gradually increased from 524.2 to 2025.8 nm as the laser heating time and the laser power extended. Nevertheless, doping AlN nanoparticles can slow down the growth rate of Cu<sub>6</sub>Sn<sub>5</sub> films in Sn solder joints due to its adsorption.</p><!--/ Abstract__block -->\\n<h3>Originality/value</h3>\\n<p>The formation of nano-Cu<sub>6</sub>Sn<sub>5</sub> films using laser heating can provide a new method for nanofilm development to realize the metallurgical interconnection in electronic packaging.</p><!--/ Abstract__block -->\",\"PeriodicalId\":49499,\"journal\":{\"name\":\"Soldering & Surface Mount Technology\",\"volume\":\"27 1\",\"pages\":\"\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2024-08-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Soldering & Surface Mount Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1108/ssmt-05-2023-0021\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-05-2023-0021","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating
Purpose
The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints.
Design/methodology/approach
This study investigates the Sn/Cu and Sn-0.1AlN/Cu structure using laser soldering under different laser power: (200, 225 and 250 W) and heating time: (2, 3 and 4 s).
Findings
The results show clearly that the formation of nano-Cu6Sn5 films is feasible in the laser heating (200 W and 2 s) with Sn/Cu and Sn-0.1AlN/Cu system. The nano-Cu6Sn5 films with thickness of 500 nm and grains with 700 nm are generally parallel to the Cu surface with Sn-0.1AlN. Both IMC films thickness of Sn/Cu and Sn-0.1AlN/Cu solder joints gradually increased from 524.2 to 2025.8 nm as the laser heating time and the laser power extended. Nevertheless, doping AlN nanoparticles can slow down the growth rate of Cu6Sn5 films in Sn solder joints due to its adsorption.
Originality/value
The formation of nano-Cu6Sn5 films using laser heating can provide a new method for nanofilm development to realize the metallurgical interconnection in electronic packaging.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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