通过 "可点击 "水凝胶的微图案化实现微孔板中的单细胞分离

IF 2.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Alexander J. Straub , Frank D. Scherag , Mark-Steven Steiner , Thomas Brandstetter , Jürgen Rühe
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引用次数: 0

摘要

在这项研究中,我们报告了一种在微结构表面分离微球或细胞的新方法。这些结构包括通过光刻技术在标准塑料微孔板底部制作的 μ 结构水凝胶涂层。该工艺基于共聚物的沉积和后续辐照,共聚物含有亲水性主成分和二苯甲酮分子,二苯甲酮分子在紫外线照射下可通过光掩模与 C、H 基团发生反应,这一过程被称为 "C、H 插入交联"(CHic)。光刻工艺用于生成蛋盒状的涂层形貌。重力、布朗运动和物理表面相互作用会将移液到表面上的颗粒或细胞驱赶到地形上的不同位置,从而在短时间后,这些位置只包含一个颗粒或细胞。我们的研究表明,只需在微孔板的涂层孔中加入悬浮液并等待很短的时间(几分钟),所提出的技术就能分离成千上万个不同的物体,如聚合物微颗粒或生物细胞。这种策略非常通用,并不针对特定类型的细胞或微颗粒,因此可以毫不费力地分离颗粒或细胞。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Single cell separation in microplates through micro patterning of “clickable” hydrogels

Single cell separation in microplates through micro patterning of “clickable” hydrogels

In this study, we report a novel approach for separating microspheres or cells on microstructured surfaces. These structures consist of μ-structured hydrogel coatings fabricated by photolithography on the bottoms of standard plastic microplate wells. The process is based on the deposition and subsequent irradiation of copolymers containing a hydrophilic main component and benzophenone moieties that can react with C, H groups during UV exposure through a photomask, a process known as “C,H insertion crosslinking” (CHic). The photolithographic process is used to generate an egg-box-like topography of the coating. Gravity, Brownian motion, and physical surface interactions drive particles or cells pipetted onto the surfaces to distinct locations on this topography so that after a short time these locations contain only one single particles or cells. We show that the presented technique enables the separation of thousands of objects as different as polymer microparticles or biological cells by simply adding a suspension to the coated wells of the microplate and wait for a short time (a few minutes). This strategy is quite general and not specific to a certain type of cell or microparticle and thus allow effortless separation of particles or cells.

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来源期刊
Micro and Nano Engineering
Micro and Nano Engineering Engineering-Electrical and Electronic Engineering
CiteScore
3.30
自引率
0.00%
发文量
67
审稿时长
80 days
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