带片上帧存储器的 5,000,000 帧/秒突发模式低温热成像仪

IF 2.2 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Solid-State Circuits Letters Pub Date : 2024-08-14 DOI:10.1109/LSSC.2024.3443744

Xiaoyu Lian;Eric Stang;Kangping Hu;Pradeep R. Guduru;Jacob K. Rosenstein

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引用次数: 0

摘要

这封信介绍了一种高速全局快门热成像系统，该系统采用了一个 24^{V} 美元\像素 HgCdTe 红外焦平面阵列 (FPA) 探测器和定制 CMOS 读出集成电路 (ROIC)，包括一个 768 帧片上模拟突发存储库。每个像素都包含一个缓冲电流注入电路和一个背景电流降低电路。该系统专为液氮温度下的低温运行而设计，最大猝发模式帧速率可达每秒 500 万帧，是已演示的中长波红外成像阵列中速度最快的。

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A 5,000,000 Frame/Sec Burst-Mode Cryogenic Thermal Imager With On-Chip Frame Memory

This letter presents a high-speed global-shutter thermal imaging system, with a

$24^{V} \times 24^{H} $

pixel HgCdTe infrared focal plane array (FPA) detector and a custom CMOS readout integrated circuit (ROIC), including a 768-frame on-chip analog burst memory bank. Each pixel contains a buffered current injection circuit and a background current reduction circuit. The system is designed for cryogenic operation at liquid nitrogen temperatures, and it achieves a maximum burst-mode frame rate of five million frames per second, which is the fastest demonstrated imaging array for mid/long-wavelength infrared.

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来源期刊

IEEE Solid-State Circuits Letters Engineering-Electrical and Electronic Engineering

CiteScore

4.30

自引率

3.70%

发文量