Xiaoying Tang;Zhiqiang Li;Lang Zeng;Hongwei Zhou;Xiaoxu Cheng;Zhenjie Yao
{"title":"基于成本敏感型密集连接深度神经网络的设备建模","authors":"Xiaoying Tang;Zhiqiang Li;Lang Zeng;Hongwei Zhou;Xiaoxu Cheng;Zhenjie Yao","doi":"10.1109/JEDS.2024.3447032","DOIUrl":null,"url":null,"abstract":"Engineers used TCAD tools for semiconductor devices modeling. However, it is computationally expensive and time-consuming for advanced devices with smaller dimensions. Therefore, this work proposes a machine learning-based device modeling algorithm to capture the complex nonlinear relationship between parameters and electrical characteristics of gate-all-around (GAA) nanowire field-effect transistors (NWFETs) from technology computer-aided design (TCAD) simulation results. This method utilizes a densely connected deep neural networks (DenseDNN), which establishes direct connections between layers in the neural networks, provides stronger feature extraction and information transmission capabilities. By incorporating cost-sensitive learning methods, the proposed model focus more on the critical data that determines device characteristics, leading to accurate prediction of key device characteristics under various parameters. Experimental results on a test dataset of 116 NWFETs demonstrate the effectiveness of this method. The DenseDNN model with cost-sensitive learning exhibits better performance than traditional deep neural networks (DNN) with various widths and depths, with a prediction error below 1.62%. Moreover, compared to TCAD simulation results, the model can speedup \n<inline-formula> <tex-math>$10^{6}\\times$ </tex-math></inline-formula>\n.","PeriodicalId":2,"journal":{"name":"ACS Applied Bio Materials","volume":null,"pages":null},"PeriodicalIF":4.6000,"publicationDate":"2024-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10643157","citationCount":"0","resultStr":"{\"title\":\"Device Modeling Based on Cost-Sensitive Densely Connected Deep Neural Networks\",\"authors\":\"Xiaoying Tang;Zhiqiang Li;Lang Zeng;Hongwei Zhou;Xiaoxu Cheng;Zhenjie Yao\",\"doi\":\"10.1109/JEDS.2024.3447032\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Engineers used TCAD tools for semiconductor devices modeling. However, it is computationally expensive and time-consuming for advanced devices with smaller dimensions. Therefore, this work proposes a machine learning-based device modeling algorithm to capture the complex nonlinear relationship between parameters and electrical characteristics of gate-all-around (GAA) nanowire field-effect transistors (NWFETs) from technology computer-aided design (TCAD) simulation results. This method utilizes a densely connected deep neural networks (DenseDNN), which establishes direct connections between layers in the neural networks, provides stronger feature extraction and information transmission capabilities. By incorporating cost-sensitive learning methods, the proposed model focus more on the critical data that determines device characteristics, leading to accurate prediction of key device characteristics under various parameters. Experimental results on a test dataset of 116 NWFETs demonstrate the effectiveness of this method. The DenseDNN model with cost-sensitive learning exhibits better performance than traditional deep neural networks (DNN) with various widths and depths, with a prediction error below 1.62%. Moreover, compared to TCAD simulation results, the model can speedup \\n<inline-formula> <tex-math>$10^{6}\\\\times$ </tex-math></inline-formula>\\n.\",\"PeriodicalId\":2,\"journal\":{\"name\":\"ACS Applied Bio Materials\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2024-08-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10643157\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Bio Materials\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10643157/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, BIOMATERIALS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Bio Materials","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10643157/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, BIOMATERIALS","Score":null,"Total":0}
Device Modeling Based on Cost-Sensitive Densely Connected Deep Neural Networks
Engineers used TCAD tools for semiconductor devices modeling. However, it is computationally expensive and time-consuming for advanced devices with smaller dimensions. Therefore, this work proposes a machine learning-based device modeling algorithm to capture the complex nonlinear relationship between parameters and electrical characteristics of gate-all-around (GAA) nanowire field-effect transistors (NWFETs) from technology computer-aided design (TCAD) simulation results. This method utilizes a densely connected deep neural networks (DenseDNN), which establishes direct connections between layers in the neural networks, provides stronger feature extraction and information transmission capabilities. By incorporating cost-sensitive learning methods, the proposed model focus more on the critical data that determines device characteristics, leading to accurate prediction of key device characteristics under various parameters. Experimental results on a test dataset of 116 NWFETs demonstrate the effectiveness of this method. The DenseDNN model with cost-sensitive learning exhibits better performance than traditional deep neural networks (DNN) with various widths and depths, with a prediction error below 1.62%. Moreover, compared to TCAD simulation results, the model can speedup
$10^{6}\times$
.