比较二维纠错码的结构

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Adahil Muniz , Lucas Mazzoco , Wagner Savaris , Eduarda Pissolatto , Tiago Beneditto , Andrew Fritsch , Jarbas Silveira , César Marcon
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引用次数: 0

摘要

集成电路生产技术的进步缩小了器件尺寸,导致阈值电压等电气特性的相应缩放。这种缩放增加了器件对电磁辐射的敏感性,提高了比特翻转概率。需要一定容错能力的系统采用纠错码 (ECC) 等技术,在一定程度上提高了缓解这一问题的可靠性。纠错和检测效率以及 ECC 的可扩展性因所采用的编码和编解码结构而异。本研究采用四种汉明码和奇偶校验码组织来执行四种二维 (2D)-ECC (N × 4p、N × ExHam、N × Ham_p 和 N × Ham2_2p)。我们研究了这四种二维 (2D-ECC) 的可扩展性、合成结果,以及在校验位和数据位数量相同的情况下的校正率和检测率。研究结果表明,采用辐射硬化存储器交叉校验校验位的 ECC 具有优势,特别是当 ECC 扩展到大型编码结构时。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparing structures of two-dimensional error correction codes

Advances in integrated circuit production technologies have reduced device sizes, leading to corresponding scaling in electrical characteristics, such as threshold voltage. This scaling has increased the susceptibility of devices to electromagnetic radiation, raising the bitflip probability. Systems requiring a certain level of fault tolerance employ techniques like Error Correction Codes (ECC), providing a degree of reliability in mitigating this issue. The error correction and detection efficacies and ECC scalability vary based on the encoding and codestruct employed. This study employs four Hamming and parity code organizations for performing four Two-Dimensional (2D)-ECCs (N × 4p, N × ExHam, N × Ham_p, and N × Ham2_2p). We investigated the scalability, synthesis results, and correction and detection rates employing the same number of check and data bits for the four 2D-ECCs. The results point to the advantages for ECCs that employ cross-checking using radiation-hardened memories for checkbits, especially when ECCs scale to large codestructs.

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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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