化学均匀性对电沉积影响的计算研究

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-06-13 DOI:10.1109/TSM.2024.3414121

Adam Chalupa;Joel Warner;Jarett Martin

{"title":"化学均匀性对电沉积影响的计算研究","authors":"Adam Chalupa;Joel Warner;Jarett Martin","doi":"10.1109/TSM.2024.3414121","DOIUrl":null,"url":null,"abstract":"Industrial semiconductor electrodeposition plating cells require recirculation of process chemicals with consistent flow and minimal contaminants to prevent defects from developing during film deposition. This manuscript investigates how recirculation nozzle quality and nozzle machining can affect bath chemical uniformity. Computational fluid dynamics simulations are utilized to visualize bath chemical velocities based on variable nozzle conditions in four case studies. Results show that strict quality control of inlet nozzles, in conjunction with proper mounting angles, induce laminar bath flow. Greater fluid uniformity and laminar flow translate to a reduction of in-line defects and increased wafer yield.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 3","pages":"238-243"},"PeriodicalIF":2.3000,"publicationDate":"2024-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Computational Study of Chemical Uniformity Impacts on Electrodeposition\",\"authors\":\"Adam Chalupa;Joel Warner;Jarett Martin\",\"doi\":\"10.1109/TSM.2024.3414121\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Industrial semiconductor electrodeposition plating cells require recirculation of process chemicals with consistent flow and minimal contaminants to prevent defects from developing during film deposition. This manuscript investigates how recirculation nozzle quality and nozzle machining can affect bath chemical uniformity. Computational fluid dynamics simulations are utilized to visualize bath chemical velocities based on variable nozzle conditions in four case studies. Results show that strict quality control of inlet nozzles, in conjunction with proper mounting angles, induce laminar bath flow. Greater fluid uniformity and laminar flow translate to a reduction of in-line defects and increased wafer yield.\",\"PeriodicalId\":451,\"journal\":{\"name\":\"IEEE Transactions on Semiconductor Manufacturing\",\"volume\":\"37 3\",\"pages\":\"238-243\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-06-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Semiconductor Manufacturing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10556741/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Semiconductor Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10556741/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

摘要

工业半导体电沉积电镀单元要求工艺化学品的再循环具有稳定的流量和最少的污染物，以防止薄膜沉积过程中产生缺陷。本手稿研究了再循环喷嘴质量和喷嘴加工如何影响镀液化学均匀性。在四个案例研究中，利用计算流体动力学模拟可视化基于不同喷嘴条件的熔池化学速度。结果表明，严格的入口喷嘴质量控制与适当的安装角度相结合，可产生层流浴。更高的流体均匀性和层流可减少在线缺陷，提高晶片产量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Computational Study of Chemical Uniformity Impacts on Electrodeposition

Industrial semiconductor electrodeposition plating cells require recirculation of process chemicals with consistent flow and minimal contaminants to prevent defects from developing during film deposition. This manuscript investigates how recirculation nozzle quality and nozzle machining can affect bath chemical uniformity. Computational fluid dynamics simulations are utilized to visualize bath chemical velocities based on variable nozzle conditions in four case studies. Results show that strict quality control of inlet nozzles, in conjunction with proper mounting angles, induce laminar bath flow. Greater fluid uniformity and laminar flow translate to a reduction of in-line defects and increased wafer yield.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.