{"title":"深入了解氮化诱导的铁氧体场效应晶体管耐力增强:用非辐射多芬模型表征缺陷特性和动力学","authors":"Yuanquan Huang;Hongye Yuan;Tiancheng Gong;Yuan Wang;Pengfei Jiang;Wei Wei;Yang Yang;Junshuai Chai;Zhicheng Wu;Xiaolei Wang;Qing Luo","doi":"10.1109/TED.2024.3435177","DOIUrl":null,"url":null,"abstract":"In this work, by analyzing the properties and dynamics of defects in detail, the role of nitrogen in improving the endurance of ferroelectric field-effect transistors (FeFETs) is clarified. First, the properties of defects (trap energy level \n<inline-formula> <tex-math>${E}_{\\text {T}}$ </tex-math></inline-formula>\n, relaxation energy \n<inline-formula> <tex-math>${E}_{\\text {R}}$ </tex-math></inline-formula>\n, and defect density \n<inline-formula> <tex-math>${N}_{\\text {T}}$ </tex-math></inline-formula>\n) of FeFETs with SiO2/SiON are investigated in depth through nonradiative multi-phonon (NMP) model. The nitridation process can significantly decrease the population and density of defects in the interfacial layer. Moreover, by comparing the defect dynamics in the interfacial and ferroelectric layers of nitridation/nonnitridation devices during cycling, we find that the nitridation process reduces the charge transition rate of defects and the number of memory window (MW) degradation pathways. The underlying mechanism of the nitridation process that can explain the increase in endurance is revealed. These findings enhance the understanding of reliability concerns in FeFET devices, paving the way for improving the performance of FeFETs.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"In-Depth Understanding of Nitridation-Induced Endurance Enhancement in FeFETs: Defect Properties and Dynamics Characterized by Nonradiative Multi-Phonon Model\",\"authors\":\"Yuanquan Huang;Hongye Yuan;Tiancheng Gong;Yuan Wang;Pengfei Jiang;Wei Wei;Yang Yang;Junshuai Chai;Zhicheng Wu;Xiaolei Wang;Qing Luo\",\"doi\":\"10.1109/TED.2024.3435177\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, by analyzing the properties and dynamics of defects in detail, the role of nitrogen in improving the endurance of ferroelectric field-effect transistors (FeFETs) is clarified. First, the properties of defects (trap energy level \\n<inline-formula> <tex-math>${E}_{\\\\text {T}}$ </tex-math></inline-formula>\\n, relaxation energy \\n<inline-formula> <tex-math>${E}_{\\\\text {R}}$ </tex-math></inline-formula>\\n, and defect density \\n<inline-formula> <tex-math>${N}_{\\\\text {T}}$ </tex-math></inline-formula>\\n) of FeFETs with SiO2/SiON are investigated in depth through nonradiative multi-phonon (NMP) model. The nitridation process can significantly decrease the population and density of defects in the interfacial layer. Moreover, by comparing the defect dynamics in the interfacial and ferroelectric layers of nitridation/nonnitridation devices during cycling, we find that the nitridation process reduces the charge transition rate of defects and the number of memory window (MW) degradation pathways. The underlying mechanism of the nitridation process that can explain the increase in endurance is revealed. These findings enhance the understanding of reliability concerns in FeFET devices, paving the way for improving the performance of FeFETs.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-08-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10630669/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10630669/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
In-Depth Understanding of Nitridation-Induced Endurance Enhancement in FeFETs: Defect Properties and Dynamics Characterized by Nonradiative Multi-Phonon Model
In this work, by analyzing the properties and dynamics of defects in detail, the role of nitrogen in improving the endurance of ferroelectric field-effect transistors (FeFETs) is clarified. First, the properties of defects (trap energy level
${E}_{\text {T}}$
, relaxation energy
${E}_{\text {R}}$
, and defect density
${N}_{\text {T}}$
) of FeFETs with SiO2/SiON are investigated in depth through nonradiative multi-phonon (NMP) model. The nitridation process can significantly decrease the population and density of defects in the interfacial layer. Moreover, by comparing the defect dynamics in the interfacial and ferroelectric layers of nitridation/nonnitridation devices during cycling, we find that the nitridation process reduces the charge transition rate of defects and the number of memory window (MW) degradation pathways. The underlying mechanism of the nitridation process that can explain the increase in endurance is revealed. These findings enhance the understanding of reliability concerns in FeFET devices, paving the way for improving the performance of FeFETs.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.