更宽 SOA SGT MOSFET,通过源极不同电阻的图案化实现自调整负反馈

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jun Ye;Weiye Mo;Xuan Xiao;Haonan Liu;Yang Song;Wei Huang;Debin Zhang;Liang Li;Hongping Ma;Qingchun Jon Zhang;D. W. Zhang
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引用次数: 0

摘要

本信首次开发了具有自调节负反馈功能的 VRS-SGT(源极分裂栅沟道 MOSFET 的可变电阻),利用图案化源极的可变电阻平衡电气和温度特性,以改善线性模式下使用的汽车功率器件的安全工作区(SOA)。在线性模式下工作时,VRS-SGT 的最大{I}_{d}$ 在 ${V}_{d} = ${V}_{g} = 10$ V 和 PT = 10 ms 条件下提高到 20 A,与传统 SGT(C-SGT)相比提高了 48%,原因是 ZTC 更低,电流-温度正反馈更弱。此外,源极电阻的低掺杂 N 区有助于 VRS-SGT 建立自镇流器负反馈机制,以提高源极电位(${V}_{s}$),从而进一步抑制寄生 NPN 的触发,同时减慢 MOSFET 的启动速度。N 区中不同的 ${R}_{s}$ 可以调整芯片内的电流分布,从而在线性模式下工作时使温度更加均匀。此外,${R}_{textit {ds}-\textit {on}}$ 的 VRS-SGT 仅增加 3%,从而在 SOA 和 ${R}_{\textit {ds}-\textit {on}}$ 之间实现了良好的权衡。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Wider SOA SGT MOSFET With Self-Adjusting Negative Feedback by Patterning the Varied Resistance of Source
VRS-SGT (Varied Resistance of Source Split Gate Trench MOSFETs) with self-adjusting negative feedback to balance the electrical and temperature characteristics, employing the varied resistance of patterned source is firstly developed in this letter to improve safe operating area (SOA) for automotive power devices used in linear mode. When operating in the linear mode, the max ${I}_{d}$ of VRS-SGT raises to 20 A in condition of ${V}_{d} = $ ${V}_{g} = 10$ V and PT = 10 ms, increased by 48% compared with Conventional-SGT (C-SGT) due to lower ZTC and weaker positive current-temperature feedback. In addition, the low doping N-region for source resistance helps the VRS-SGT set up the self-ballast negative feedback mechanism to increase the source potential ( ${V}_{s}$ ), which can further suppress the trigger of parasitic NPN while slowing down the startup of MOSFETs. Varied ${R}_{s}$ in N-region can adjust the current distribution within the chip so that the temperature tends to be more uniform when operating in linear mode. In addition, the ${R}_{\textit {ds}-\textit {on}} $ of VRS-SGT increases by only 3%, achieving a good trade-off between SOA and ${R}_{\textit {ds}-\textit {on}}$ .
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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