生命周期评估 (LCA) 和多标准决策 (MCDM):电力电子封装用封装材料评估

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jiaxuan Wang;Pan Liu
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引用次数: 0

摘要

随着电力电子技术的发展,对高温封装材料的需求越来越大,特别是对铝酸钙、磷酸盐水泥基材料(CE)等封装材料的需求。因此,有必要对这类新型封装材料进行环境影响分析。本文利用 Simapro 软件和 ReCiPe2016 方法,首先通过生命周期评估(LCA)对四种封装材料进行了环境影响评价,包括三种聚合物基材料,即环氧树脂(EP)、聚氨酯(PU)和硅凝胶(SG)以及一种新型铝酸钙基 CE。生命周期分析表明,CE 是最环保的选择,其次是 EP、PU 和 SG。生命周期评估的结果以及其他六项标准,即最高工作温度、热膨胀系数 (CTE)、热导率 (TC)、体积电阻率 (R $_{\mathrm {V}}$ )、粘度和成本,被进一步纳入多标准决策 (MCDM) 计算的适用性考虑范围。采用层次分析法(AHP)加权法和与理想解相似度排序技术(TOPSIS)评价法,MCDM 结果显示封装剂的优选排序依次为 CE、EP、PU、SG。根据 LCA 和 MCDM 的结果,CE 获得了优异的评价结果,这表明其作为电力电子封装材料的巨大潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Life Cycle Assessment (LCA) and Multicriteria Decision Making (MCDM): An Evaluation of Encapsulants for Power Electronics Packaging
With the development of power electronics, there is an increasing demand for high-temperature packaging materials, especially for encapsulants such as calcium aluminate, phosphate cement-based materials (CEs), etc. Therefore, environmental impact analysis for such novel encapsulants becomes necessary. In this article, four encapsulation materials were first evaluated through life cycle assessment (LCA) for environmental impact, including three polymer-based materials, namely epoxy (EP) resin, polyurethane (PU), and silicone gel (SG) and a novel calcium aluminate CE, with the utilization of software Simapro and the method ReCiPe2016. The LCA revealed that CE emerged as the most environmentally friendly option, followed by EP, PU, and SG. The results of LCA, together with six other criteria, namely maximum operating temperature, coefficient of thermal expansion (CTE), thermal conductivity (TC), volume resistivity (R $_{\mathrm {V}}$ ), viscosity, and costs, were further taken into account for a multicriteria decision making (MCDM) calculation for suitability. With the analytic hierarchy process (AHP) weighting method and the technique of order preference similarity to the ideal solution (TOPSIS) evaluation method applied, the MCDM results presented the preference ranking order of the encapsulants which was CE, EP, PU, SG. According to the findings from LCA and MCDM, CE received an outstanding evaluation result, which indicates its great potential as an encapsulation material for power electronics packaging.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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