Two-step sub-modeling framework for thermomechanical fatigue analysis of solder joints in DRAM module

The characteristics of thermomechanical fatigue life of complex electronic device system, micro-scaled design, is highly sensitive to changes in design factors. The solder ball, which acts as a linkage between the circuit board and the package, is a vital part to examine the performance of electronic device system. Repeated thermal loading causes the solder crack growth in models, eventually leads to the breakdown of devices. There have been lots of studies on investigating the fatigue life of solder joints employing well-established finite element procedure. However, generating a finite element model reflecting the whole device often requires unnecessarily large finite element matrices which may increase the computational cost and solder joint fatigue life can be highly dependent on the mesh resolutions. Recent studies suggest the sub-modeling method to handle the meshing process and alleviate the computational cost. In this paper, we delineate the methodology of two-step sub-modeling framework, aimed at improving the mesh fidelity of complex models while ensuring the efficiency of labor-intensive process of solder joint fatigue analysis. We employ the strain energy-based Darveaux's fatigue model to predict the fatigue life of solder joints. Through the investigation of the predicted fatigue life of solder joints across various sets of design parameters, it has been observed that the design factors of electronic devices exhibit a clear pattern in relation to the predicted fatigue life, even when only the second step of two-step sub-modeling framework is considered. Our findings suggest that it is efficient to utilize solely the second step of two-step sub-modeling framework to identify an appropriate reduced design space, where design parameters can be strategically selected for designing an optimal model.