基于强耦合新型三柱排列的具有传输零点的 3-D 打印紧凑型内嵌波导滤波器

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Iqram Haider;Shiban Kishen Koul;Ananjan Basu
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引用次数: 0

摘要

本文介绍了一种新型紧凑型内嵌波导带通滤波器,该滤波器采用新型非线性变频耦合(NFVC)逆变器,只需通过三维打印即可制造,在上阻带具有尖锐的抑制能力。所提出的 NFVC 逆变器由三个紧密间隔的支柱组成,其中中间的支柱是斜的,排列在波导宽壁的中心。利用新颖的斜柱,该逆变器可在三个 TZ 上提供两个极点。此外,通过改变中间支柱的倾斜角度,其中一个 TZ 可以非常靠近通带的两侧。为了证明其实用性,我们设计、制造并测量了一个工作频率为 7.9 GHz、带宽(BW)为 1.5 GHz、具有三个 TZ 的四阶直插式波导滤波器。正如我们将看到的那样,传统的制造方法,如铣削,对于这种结构是不切实际的。此外,测量结果与电磁模拟结果十分吻合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 3-D Printed Compact Inline Waveguide Filter With Transmission Zeros Based on Strongly Coupled Novel Triple-Post Arrangement
This article presents a new class of compact, inline waveguide bandpass filters with sharp rejection capabilities at the upper stopband using a novel nonlinear frequency variant coupling (NFVC) inverter, which can be fabricated only by 3-D printing. The proposed NFVC inverter is composed of three closely spaced posts, including the middle one slanted, arranged at the center of the waveguide’s broad wall. Utilizing the novel slanted post, this inverter can provide two poles above three TZs. Additionally, one of the TZs can be located very close to both sides of the passband by changing the middle post’s slant angle. To demonstrate its usefulness, a fourth-order inline waveguide filter with an operating frequency of 7.9 GHz, a bandwidth (BW) of 1.5 GHz, and three TZs is designed, fabricated, and measured. As will be seen, conventional manufacturing methods, such as milling, are impractical for this structure. Furthermore, the measured results are in reasonable agreement with the electromagnetic (EM) simulated ones.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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