增强神经紧凑模型的可解释性:实现可靠的设备建模

IF 4.6 Q2 MATERIALS SCIENCE, BIOMATERIALS
Chanwoo Park;Hyunbo Cho;Jungwoo Lee
{"title":"增强神经紧凑模型的可解释性:实现可靠的设备建模","authors":"Chanwoo Park;Hyunbo Cho;Jungwoo Lee","doi":"10.1109/JEDS.2024.3409572","DOIUrl":null,"url":null,"abstract":"Neural Compact Models (NCMs) have emerged as a crucial tool to meet the stringent demands of Design-Technology Co-Optimization (DTCO) and to overcome the complexities and prolonged development cycles encountered in traditional compact model creation. Despite their efficiency in simulating electronic devices, a significant barrier to the widespread adoption of NCMs in the industry remains: the lack of interpretability. In the semiconductor sector, where inaccuracies or failures can lead to considerable financial consequences, it is critical to ensure that the model’s predictions are both understandable and reliable. This study aims to enhance the interpretability of NCMs used for I-V and C-V characterizations by clarifying the physical significance of latent vectors. A regularization technique is employed to disentangle features within the latent space, and interpolation is used to visualize and elucidate each dimension’s physical impact. Our approach, which offers interpretable insights into the model’s functionality, seeks to encourage broader implementation of NCMs in the industry, thus accelerating advancements in DTCO.","PeriodicalId":2,"journal":{"name":"ACS Applied Bio Materials","volume":null,"pages":null},"PeriodicalIF":4.6000,"publicationDate":"2024-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10547540","citationCount":"0","resultStr":"{\"title\":\"Enhancing Interpretability of Neural Compact Models: Toward Reliable Device Modeling\",\"authors\":\"Chanwoo Park;Hyunbo Cho;Jungwoo Lee\",\"doi\":\"10.1109/JEDS.2024.3409572\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Neural Compact Models (NCMs) have emerged as a crucial tool to meet the stringent demands of Design-Technology Co-Optimization (DTCO) and to overcome the complexities and prolonged development cycles encountered in traditional compact model creation. Despite their efficiency in simulating electronic devices, a significant barrier to the widespread adoption of NCMs in the industry remains: the lack of interpretability. In the semiconductor sector, where inaccuracies or failures can lead to considerable financial consequences, it is critical to ensure that the model’s predictions are both understandable and reliable. This study aims to enhance the interpretability of NCMs used for I-V and C-V characterizations by clarifying the physical significance of latent vectors. A regularization technique is employed to disentangle features within the latent space, and interpolation is used to visualize and elucidate each dimension’s physical impact. Our approach, which offers interpretable insights into the model’s functionality, seeks to encourage broader implementation of NCMs in the industry, thus accelerating advancements in DTCO.\",\"PeriodicalId\":2,\"journal\":{\"name\":\"ACS Applied Bio Materials\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2024-06-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10547540\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Bio Materials\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10547540/\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, BIOMATERIALS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Bio Materials","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10547540/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, BIOMATERIALS","Score":null,"Total":0}
引用次数: 0

摘要

神经集成模型 (NCM) 已成为满足设计-技术协同优化 (DTCO) 的严格要求以及克服传统集成模型创建过程中遇到的复杂性和延长开发周期的重要工具。尽管 NCM 在模拟电子设备方面非常高效,但其在行业中的广泛应用仍面临一个重大障碍:缺乏可解释性。在半导体行业,不准确或故障可能导致严重的经济后果,因此确保模型预测的可理解性和可靠性至关重要。本研究旨在通过阐明潜向量的物理意义,提高用于 I-V 和 C-V 特性分析的 NCM 的可解释性。我们采用了正则化技术来分解潜空间内的特征,并使用插值法来直观地阐明每个维度的物理影响。我们的方法为模型的功能提供了可解释的见解,旨在鼓励在行业中更广泛地实施 NCM,从而加快 DTCO 的发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhancing Interpretability of Neural Compact Models: Toward Reliable Device Modeling
Neural Compact Models (NCMs) have emerged as a crucial tool to meet the stringent demands of Design-Technology Co-Optimization (DTCO) and to overcome the complexities and prolonged development cycles encountered in traditional compact model creation. Despite their efficiency in simulating electronic devices, a significant barrier to the widespread adoption of NCMs in the industry remains: the lack of interpretability. In the semiconductor sector, where inaccuracies or failures can lead to considerable financial consequences, it is critical to ensure that the model’s predictions are both understandable and reliable. This study aims to enhance the interpretability of NCMs used for I-V and C-V characterizations by clarifying the physical significance of latent vectors. A regularization technique is employed to disentangle features within the latent space, and interpolation is used to visualize and elucidate each dimension’s physical impact. Our approach, which offers interpretable insights into the model’s functionality, seeks to encourage broader implementation of NCMs in the industry, thus accelerating advancements in DTCO.
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来源期刊
ACS Applied Bio Materials
ACS Applied Bio Materials Chemistry-Chemistry (all)
CiteScore
9.40
自引率
2.10%
发文量
464
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