激光辐射对 MOS 器件结构功能特性的影响

Q4 Engineering
S. Sh. Rekhviashvili, D. S. Gaev
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引用次数: 0

摘要

摘要 研究了 MOS 器件结构(电容器、具有绝缘栅极和感应沟道的场效应晶体管、CMOS 集成电路)在未调制激光辐射下的电气和物理特性。测量了静态和动态特性。理论研究使用开发的 SPICE 模型和数值实验进行。获得了在恒定光照模式下工作的场效应晶体管的伏安特性 (VAC) 表达式。研究表明,非平衡电荷载流子的产生和重组、场效应、p-n 结中的光电效应、邓伯效应以及电荷载流子通过栅极电介质的隧道效应决定了晶体管结构的特性。研究结果对制造新型高速晶体管和集成电路具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Influence of Laser Radiation on Functional Properties MOS Device Structures

Influence of Laser Radiation on Functional Properties MOS Device Structures

Abstract

The electrical and physical properties of MOS device structures (capacitor, field-effect transistor with an insulated gate and induced channel, CMOS integrated circuit) when exposed to unmodulated laser radiation are studied. The static and dynamic characteristics are measured. The theoretical study is carried out using the developed SPICE models and numerical experiments. An expression is obtained for the volt-ampere characteristics (VACs) of a field-effect transistor operating in a mode with constant optical illumination. It is shown that the characteristics of structures are determined by the generation and recombination of nonequilibrium charge carriers, the field effect, and the photovoltaic effect in p–n-junctions, the Dember effect, and the tunneling of charge carriers through the gate dielectric. The results of the study are of interest in terms of creating high-speed transistors and integrated circuits of a new type.

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来源期刊
Russian Microelectronics
Russian Microelectronics Materials Science-Materials Chemistry
CiteScore
0.70
自引率
0.00%
发文量
43
期刊介绍: Russian Microelectronics  covers physical, technological, and some VLSI and ULSI circuit-technical aspects of microelectronics and nanoelectronics; it informs the reader of new trends in submicron optical, x-ray, electron, and ion-beam lithography technology; dry processing techniques, etching, doping; and deposition and planarization technology. Significant space is devoted to problems arising in the application of proton, electron, and ion beams, plasma, etc. Consideration is given to new equipment, including cluster tools and control in situ and submicron CMOS, bipolar, and BICMOS technologies. The journal publishes papers addressing problems of molecular beam epitaxy and related processes; heterojunction devices and integrated circuits; the technology and devices of nanoelectronics; and the fabrication of nanometer scale devices, including new device structures, quantum-effect devices, and superconducting devices. The reader will find papers containing news of the diagnostics of surfaces and microelectronic structures, the modeling of technological processes and devices in micro- and nanoelectronics, including nanotransistors, and solid state qubits.
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