在超薄柔性聚合物基底上快速、多用途地对复杂结构进行微图案化和功能化处理

IF 2.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
E. Cunaj , E. Gogolides , A. Tserepi , K. Ellinas
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引用次数: 0

摘要

在可穿戴传感器和基于微流控技术的诊断等许多应用中,柔性基底上的微米级图案化都非常重要,因此,可扩展且适合大规模生产的低成本制造方法吸引了许多公司和研究团体的兴趣。干膜抗蚀剂(DFRs)是可在市场上买到的材料,其特性适合在柔性基底上使用,应用范围广泛,与液态抗蚀剂相比,产生的废料少,具有环保和可持续发展的优势。然而,文献中关于使用 DFR 在薄而柔性的基底上制造微流体通道或其他微图案(即柱)的详细报道并不多。在此,我们将详细介绍:a) 宽度从 50 μm 到 800 μm,深度从 30 μm 到 270 μm 的微流体通道的制造方法;b) 尺寸为 80 μm × 80 μm、高度为 30 μm 的方形柱子的制造方法。特别是,我们的方法可以在超薄柔性基底上制造超深微通道(深度为 250 微米)、大面积高度有序的柱阵列(约 60 平方厘米),以及具有分层尺度特征的复杂设计(800 微米微通道内的 80 微米柱或微通道内的微纳米纹理)。为了证明该方法的多功能性,在超薄(30 μm)、柔性、单面覆铜聚酰亚胺基底上使用了三种不同的 DFR。研究还表明,可利用等离子刻蚀技术对 DFR 进行有效改性,以调整其表面润湿特性,使其适应无泵毛细管作用等需要此类功能的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Rapid and versatile, micro-patterning and functionalization of complex structures on ultra-thin and flexible polymeric substrates

Rapid and versatile, micro-patterning and functionalization of complex structures on ultra-thin and flexible polymeric substrates

Microscale patterning on flexible substrates is important in many applications such as in wearable sensors and microfluidics-based diagnostics, therefore low-cost fabrication methods which are scalable and amenable to mass production have attracted the interest of many companies and research groups. Dry film resists (DFRs) are commercially available materials with properties compatible with their implementation on flexible substrates to cover a wide range of applications, which also offer environmental and sustainability benefits due to the low waste generation compared to the liquid resists. However, there are limited detailed reports in the literature regarding the use of DFRs for the fabrication of microfluidic channels or other micropatterns (i.e., posts) on thin and flexible substrates. Herein we present in detail the fabrication of: a) microfluidic channels of width ranging from 50 μm up to 800 μm, and depth ranging from 30 μm up to 270 μm and b) square posts 80 μm × 80 μm in size and 30 μm in height. Particularly, our method enables the fabrication of ultra-deep microchannels (depth > 250 μm), highly ordered post arrays over large area (appr. 60 cm2), as well as complex designs with hierarchical scale features (80 μm posts inside 800 μm microchannels or micro-nanotexturing inside microchannels) on ultra-thin flexible substrates. To demonstrate the versatility of the method, three different DFRs were used on ultra-thin (30 μm), flexible, single-sided copper-clad polyimide substrates. It is also demonstrated that DFRs can be effectively modified using plasma etching to tune the surface wetting properties towards applications such as pumpless capillary action, where such functionality is required.

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来源期刊
Micro and Nano Engineering
Micro and Nano Engineering Engineering-Electrical and Electronic Engineering
CiteScore
3.30
自引率
0.00%
发文量
67
审稿时长
80 days
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