{"title":"通过超临界二氧化碳辅助无电解NiP电镀实现具有三维结构的聚醚酰亚胺的金属化","authors":"Ami Iwasaki , Tomoyuki Kurioka , Po-Wei Cheng , Chun-Yi Chen , Tso-Fu Mark Chang , Kei Takase , Hiroshi Ishihata , Masato Sone","doi":"10.1016/j.mne.2024.100271","DOIUrl":null,"url":null,"abstract":"<div><p>Polyetherimide (PEI) with 3-dimensional (3D) structures is a promising material for applications in electronic devices because of its numerous attractive properties. In the applications of PEI, the low electrical conductivity is often a shortcoming. The electrical conductivity can be improved by a metallization process. Electroless plating is a common metallization process for polymeric materials; however, conventional electroless plating process scarcely provides the metallized PEI. In this work, we overcome this limitation by a supercritical carbon dioxide (scCO<sub>2</sub>)-assisted electroless Ni<img>P plating process. This scCO<sub>2</sub>-assisted electroless Ni<img>P plating allows metallization of PEI with 3D structures and realizes a low electrical resistance suitable for practical use in the electronic devices.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"24 ","pages":"Article 100271"},"PeriodicalIF":2.8000,"publicationDate":"2024-07-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S2590007224000340/pdfft?md5=41872f2bcd2b04fdea495c5e3c930e06&pid=1-s2.0-S2590007224000340-main.pdf","citationCount":"0","resultStr":"{\"title\":\"Metallization of polyetherimide with 3D structures by supercritical carbon dioxide-assisted electroless NiP plating\",\"authors\":\"Ami Iwasaki , Tomoyuki Kurioka , Po-Wei Cheng , Chun-Yi Chen , Tso-Fu Mark Chang , Kei Takase , Hiroshi Ishihata , Masato Sone\",\"doi\":\"10.1016/j.mne.2024.100271\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Polyetherimide (PEI) with 3-dimensional (3D) structures is a promising material for applications in electronic devices because of its numerous attractive properties. In the applications of PEI, the low electrical conductivity is often a shortcoming. The electrical conductivity can be improved by a metallization process. Electroless plating is a common metallization process for polymeric materials; however, conventional electroless plating process scarcely provides the metallized PEI. In this work, we overcome this limitation by a supercritical carbon dioxide (scCO<sub>2</sub>)-assisted electroless Ni<img>P plating process. This scCO<sub>2</sub>-assisted electroless Ni<img>P plating allows metallization of PEI with 3D structures and realizes a low electrical resistance suitable for practical use in the electronic devices.</p></div>\",\"PeriodicalId\":37111,\"journal\":{\"name\":\"Micro and Nano Engineering\",\"volume\":\"24 \",\"pages\":\"Article 100271\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-07-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.sciencedirect.com/science/article/pii/S2590007224000340/pdfft?md5=41872f2bcd2b04fdea495c5e3c930e06&pid=1-s2.0-S2590007224000340-main.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Micro and Nano Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2590007224000340\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micro and Nano Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2590007224000340","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Metallization of polyetherimide with 3D structures by supercritical carbon dioxide-assisted electroless NiP plating
Polyetherimide (PEI) with 3-dimensional (3D) structures is a promising material for applications in electronic devices because of its numerous attractive properties. In the applications of PEI, the low electrical conductivity is often a shortcoming. The electrical conductivity can be improved by a metallization process. Electroless plating is a common metallization process for polymeric materials; however, conventional electroless plating process scarcely provides the metallized PEI. In this work, we overcome this limitation by a supercritical carbon dioxide (scCO2)-assisted electroless NiP plating process. This scCO2-assisted electroless NiP plating allows metallization of PEI with 3D structures and realizes a low electrical resistance suitable for practical use in the electronic devices.
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