氧化锌-二氧化硅薄膜的电子传输性能研究:晶界屏障的构建

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Yidong Zhang
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引用次数: 0

摘要

设计/方法/途径采用简单的溶胶-凝胶法在玻璃基底上制备氧化锌-二氧化硅(ZnO-SiO2)薄膜。采用铜 (Cu) Kα 辐射 X 射线衍射测试了氧化锌和氧化锌-二氧化硅粉末的晶体结构。紫外-可见分光光度计记录了 ZnO 和 ZnO-SiO2 薄膜的吸收光谱。结果表明,ZnO-SiO2 薄膜的电流减小,表明 ZnO-SiO2 薄膜的迁移率大大降低,这是由于 ZnO 和 SiO2 之间形成了晶界屏障。通过简单的溶胶-凝胶法在玻璃基底上制备了 ZnO 和 ZnO-5SiO2 薄膜,首先利用 CAFM 和 EFM 对其进行了研究。ZnO和ZnO-5SiO2的带隙分别为3.05 eV和3.15 eV。引入 SiO2 后,ZnO-5SiO2 薄膜的势垒高度增加了 ∼0.015 eV。掺杂 SiO2 后,由于 GB 势垒的增加,相变强度也有一定程度的增加。ZnO-5SiO2 薄膜将成为 QLED 应用领域中一种有前途的 ETL 候选材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier

Purpose

The purpose of this study is to adjust the electronic transport performance of zinc oxide–silicon dioxide (ZnO-SiO2) film by the construction of a grain boundary barrier.

Design/methodology/approach

ZnO-SiO2 thin films were prepared on glass substrates by a simple sol-gel method. The crystal structure of ZnO and ZnO-SiO2 powders were tested by X-ray diffraction with copper (Cu) Kα radiation. The absorption spectra of ZnO and ZnO-SiO2 films were recorded by a ultraviolet-visible spectrophotometer. The micro electrical transport performance of ZnO-SiO2 thin films were investigated by conductive atomic force microscope and electrostatic force microscope.

Findings

The results show that the current of ZnO-SiO2 film decrease, indicating that the mobility of ZnO-SiO2 film is greatly decreased, owing to the formation of the grain boundary barrier between ZnO and SiO2. The phase variation of ZnO-SiO2 film increases due to the electron accumulation at grain boundaries.

Originality/value

ZnO and ZnO-5SiO2 thin films prepared on glass substrates by a simple sol-gel method were first studied by CAFM and EFM. The band gaps of ZnO and ZnO-5SiO2 is ∼3.05 eV and 3.15 eV, respectively. The barrier height of ZnO-5SiO2 film increased by ∼0.015 eV after introducing SiO2. The phase variation intensity increased to a certain extent after doping SiO2, due to the increased GB barrier. ZnO-5SiO2 film will be a promising ETL candidate in the application of QLEDs field.

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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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