{"title":"利用随机伽勒金和张量分解进行高维不确定性量化","authors":"Ziyuan Wang;Karanvir S. Sidhu;Roni Khazaka","doi":"10.1109/TCPMT.2024.3418342","DOIUrl":null,"url":null,"abstract":"This article investigates the application of tensor decomposition and the stochastic Galerkin method for the uncertainty quantification of complex systems characterized by high parameter dimensionality. By employing these methods, we construct surrogate models aimed at efficiently predicting system output uncertainty. The effectiveness of our approaches is demonstrated through a comparative analysis of accuracy and central processing unit (CPU) cost with conventional Galerkin methods, using two transmission line circuit examples with up to 25 parameters.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":null,"pages":null},"PeriodicalIF":2.3000,"publicationDate":"2024-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition\",\"authors\":\"Ziyuan Wang;Karanvir S. Sidhu;Roni Khazaka\",\"doi\":\"10.1109/TCPMT.2024.3418342\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article investigates the application of tensor decomposition and the stochastic Galerkin method for the uncertainty quantification of complex systems characterized by high parameter dimensionality. By employing these methods, we construct surrogate models aimed at efficiently predicting system output uncertainty. The effectiveness of our approaches is demonstrated through a comparative analysis of accuracy and central processing unit (CPU) cost with conventional Galerkin methods, using two transmission line circuit examples with up to 25 parameters.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2024-06-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10568962/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10568962/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition
This article investigates the application of tensor decomposition and the stochastic Galerkin method for the uncertainty quantification of complex systems characterized by high parameter dimensionality. By employing these methods, we construct surrogate models aimed at efficiently predicting system output uncertainty. The effectiveness of our approaches is demonstrated through a comparative analysis of accuracy and central processing unit (CPU) cost with conventional Galerkin methods, using two transmission line circuit examples with up to 25 parameters.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.