焊接温度和预热温度对波峰焊锡锌焊料合金性能的影响

IF 1.7 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Songtao Qu, Qingyu Shi, Gong Zhang, Xinhua Dong, Xiaohua Xu
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引用次数: 0

摘要

目的 本研究旨在解决工业生产中使用 Sn-9Zn-2.5 Bi-1.5In 合金进行低温波峰焊的问题,并制定合格的工艺参数。Sn-Zn 共晶合金因其低熔点、高强度和低成本而成为消费类电子产品中的无铅焊料。本文探讨了 Sn-Zn 合金(SN-9ZN-2.5BI-1.5 In)低温波峰焊工艺参数的开发和实施。研究结果Sn-9Zn-2.5Bi-1.5In 合金能克服 Zn 氧化问题,实现低温波峰焊接并达到 IPC 标准,但需要开发氮气保护装置并优化一系列工艺参数。设计实验揭示了预热温度、焊接温度和助焊剂对失效现象的影响。最后,结合工艺试验结果,提出了支持批量生产的有效方法。研究局限/意义在克服 Zn 的氧化特性方面,需要研究抗氧化波峰焊装置。需要开发各种工艺参数,以实现比有铅焊料(锡铅)和无铅 SAC(锡-0.3Ag-0.7Cu)温度更低的焊接工艺。Sn-Zn 系列合金(Sn-9Zn-2.5 Bi-1.5In 合金)的工艺窗口较窄。实际意义在这项研究中,Sn-9Zn-2.5 Bi-1.5In 的焊接温度比 Sn-Pb 和 Sn-0.3Ag-0.7Cu(SAC0307) 低 5 ℃ 和 25 ℃。社会意义低温波峰焊可以广泛支持绿色制造,为许多工厂实现碳排放提供了新的途径,同时也可以应对国际气候变化。尤其是可大规模生产的过程控制方法更具挑战性。此外,金属储量很高,成本相对较低,这对提供企业竞争力有很大帮助,还能支持绿色制造的发展,对 Sn-Zn 系列更广泛的发展有很好的促进作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering

Purpose

This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied in consumer electronics due to their low melting point, high strength, and low cost. In the electronic assembly industry, Sn–Zn eutectic alloys have great potential for use.

Design/methodology/approach

This paper explored developing and implementing process parameters for low-temperature wave soldering of Sn–Zn alloys (SN-9ZN-2.5BI-1.5 In). A two-factor, three-level design of the experiments experiment was designed to simulate various conditions parameters encountered in Sn–Zn soldering, developed the nitrogen protection device of waving soldering and proposed the optimal process parameters to realize mass production of low-temperature wave soldering on Sn–Zn alloys.

Findings

The Sn-9Zn-2.5 Bi-1.5In alloy can overcome the Zn oxidation problem, achieve low-temperature wave soldering and meet IPC standards, but requires the development of nitrogen protection devices and the optimization of a series of process parameters. The design experiment reveals that preheating temperature, soldering temperature and flux affect failure phenomena. Finally, combined with the process test results, an effective method to support mass production.

Research limitations/implications

In term of overcome Zn’s oxidation characteristics, anti-oxidation wave welding device needs to be studied. Various process parameters need to be developed to achieve a welding process with lower temperature than that of lead solder(Sn–Pb) and lead-free SAC(Sn-0.3Ag-0.7Cu). The process window of Sn–Zn series alloy (Sn-9Zn-2.5 Bi-1.5In alloy) is narrow. A more stringent quality control chart is required to make mass production.

Practical implications

In this research, the soldering temperature of Sn-9Zn-2.5 Bi-1.5In is 5 °C and 25 °C lower than Sn–Pb and Sn-0.3Ag-0.7Cu(SAC0307). To the best of the authors’ knowledge, this work was the first time to apply Sn–Zn solder alloy under actual production conditions on wave soldering, which was of great significance for the study of wave soldering of the same kind of solder alloy.

Social implications

Low-temperature wave soldering can supported green manufacturing widely, offering a new path to achieve carbon emissions for many factories and also combat to international climate change.

Originality/value

There are many research papers on Sn–Zn alloys, but methods of achieving low-temperature wave soldering to meet IPC standards are infrequent. Especially the process control method that can be mass-produced is more challenging. In addition, the metal storage is very high and the cost is relatively low, which is of great help to provide enterprise competitiveness and can also support the development of green manufacturing, which has a good role in promoting the broader development of the Sn–Zn series.

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来源期刊
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 工程技术-材料科学:综合
CiteScore
4.10
自引率
15.00%
发文量
30
审稿时长
>12 weeks
期刊介绍: Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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