测试设计与硅生命周期管理的未来

IF 1.9 4区工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Design & Test Pub Date : 2023-11-20 DOI:10.1109/mdat.2023.3335195

Janusz Rajski, Vivek Chickermane, Jean-François Côté, Stephan Eggersglüß, Nilanjan Mukherjee, Jerzy Tyszer

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引用次数: 0

摘要

编者按汽车电子和数据中心等安全关键型应用需要高可靠性。在硅片生命周期中整合测试设计（DFT）可应对系统内和现场操作的挑战，本文对此进行了综述。- Mehdi B. Tahoori，德国卡尔斯鲁厄理工学院

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The Future of Design for Test and Silicon Lifecycle Management

Editor’s notes: Safety-critical applications, such as automotive electronics and data centers, demand high reliability. Integrating design-for-test (DFT) across silicon lifecycle addresses challenges for in-system and in-field operations, which are reviewed in this article. — Mehdi B. Tahoori, Karlsruhe Institute of Technology, Germany

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来源期刊

IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

3.80

自引率

5.00%

发文量

期刊介绍： IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.