{"title":"烧结温度对纳米银烧结搭接剪切接头棘轮疲劳行为的影响","authors":"Danqing Fang, Chengjin Wu, Yansong Tan, Xin Li, Lilan Gao, Chunqiu Zhang, Bingjie Zhao","doi":"10.1108/ssmt-08-2023-0047","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>The paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition, the Gerber model is used to predict the ratcheting fatigue lives of nanosilver sintered lap shear joints at different sintering temperatures.</p><!--/ Abstract__block -->\n<h3>Design/methodology/approach</h3>\n<p>In this paper, the nanosilver sintered lap shear joints were prepared at three sintering temperatures of 250 °C, 280 °C and 310 °C. The bonding quality was characterized by scanning electron microscopy, X-ray diffraction, transmission electron microscope and shear tests, and the long-term reliability was studied by conducting ratcheting fatigue tests. In addition, three modified models based on Basquin equation were used to predict the ratcheting fatigue life of nanosilver sintered lap shear joint and their accuracies were evaluated.</p><!--/ Abstract__block -->\n<h3>Findings</h3>\n<p>When the sintering temperature is 250°C, the nanosilver sintered lap shear joint shows the porosity of 22.9 ± 1.6 %, and the shear strength of 22.3 ± 2.4 MPa. Raising the sintering temperature enhances silver crystallite size, strengthens sintering necks, thus improves shear strength and ratcheting fatigue life in joints. In addition, the ratcheting fatigue lives of the joints sintered at different temperatures are effectively predicted by three equivalent force models, and the Gerber model shows the highest life prediction accuracy.</p><!--/ Abstract__block -->\n<h3>Research limitations/implications</h3>\n<p>The sintered silver bondline is suffering a complex stress state. The study only takes the shear stress into consideration. The tensile stress and the combination of shear stress and tensile stress can to be considered in the future study.</p><!--/ Abstract__block -->\n<h3>Practical implications</h3>\n<p>The paper provides the experimental and theoretical support for robust bonding and long-term reliability of sintered silver structure.</p><!--/ Abstract__block -->\n<h3>Social implications</h3>\n<p>The introduced model can predict the ratcheting fatigue lives of the joints sintered at different temperatures, which shows a potential in engineering applications.</p><!--/ Abstract__block -->\n<h3>Originality/value</h3>\n<p>The study revealed the relationship between the sintering temperature and the microstructure, the shear strength and the ratcheting fatigue life of the joint. In addition, the Gerber model can predict the ratcheting fatigue life accurately at different sintering temperatures.</p><!--/ Abstract__block -->","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":"107 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2024-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint\",\"authors\":\"Danqing Fang, Chengjin Wu, Yansong Tan, Xin Li, Lilan Gao, Chunqiu Zhang, Bingjie Zhao\",\"doi\":\"10.1108/ssmt-08-2023-0047\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3>Purpose</h3>\\n<p>The paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition, the Gerber model is used to predict the ratcheting fatigue lives of nanosilver sintered lap shear joints at different sintering temperatures.</p><!--/ Abstract__block -->\\n<h3>Design/methodology/approach</h3>\\n<p>In this paper, the nanosilver sintered lap shear joints were prepared at three sintering temperatures of 250 °C, 280 °C and 310 °C. The bonding quality was characterized by scanning electron microscopy, X-ray diffraction, transmission electron microscope and shear tests, and the long-term reliability was studied by conducting ratcheting fatigue tests. In addition, three modified models based on Basquin equation were used to predict the ratcheting fatigue life of nanosilver sintered lap shear joint and their accuracies were evaluated.</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>When the sintering temperature is 250°C, the nanosilver sintered lap shear joint shows the porosity of 22.9 ± 1.6 %, and the shear strength of 22.3 ± 2.4 MPa. Raising the sintering temperature enhances silver crystallite size, strengthens sintering necks, thus improves shear strength and ratcheting fatigue life in joints. In addition, the ratcheting fatigue lives of the joints sintered at different temperatures are effectively predicted by three equivalent force models, and the Gerber model shows the highest life prediction accuracy.</p><!--/ Abstract__block -->\\n<h3>Research limitations/implications</h3>\\n<p>The sintered silver bondline is suffering a complex stress state. The study only takes the shear stress into consideration. The tensile stress and the combination of shear stress and tensile stress can to be considered in the future study.</p><!--/ Abstract__block -->\\n<h3>Practical implications</h3>\\n<p>The paper provides the experimental and theoretical support for robust bonding and long-term reliability of sintered silver structure.</p><!--/ Abstract__block -->\\n<h3>Social implications</h3>\\n<p>The introduced model can predict the ratcheting fatigue lives of the joints sintered at different temperatures, which shows a potential in engineering applications.</p><!--/ Abstract__block -->\\n<h3>Originality/value</h3>\\n<p>The study revealed the relationship between the sintering temperature and the microstructure, the shear strength and the ratcheting fatigue life of the joint. In addition, the Gerber model can predict the ratcheting fatigue life accurately at different sintering temperatures.</p><!--/ Abstract__block -->\",\"PeriodicalId\":49499,\"journal\":{\"name\":\"Soldering & Surface Mount Technology\",\"volume\":\"107 1\",\"pages\":\"\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2024-05-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Soldering & Surface Mount Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1108/ssmt-08-2023-0047\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-08-2023-0047","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint
Purpose
The paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition, the Gerber model is used to predict the ratcheting fatigue lives of nanosilver sintered lap shear joints at different sintering temperatures.
Design/methodology/approach
In this paper, the nanosilver sintered lap shear joints were prepared at three sintering temperatures of 250 °C, 280 °C and 310 °C. The bonding quality was characterized by scanning electron microscopy, X-ray diffraction, transmission electron microscope and shear tests, and the long-term reliability was studied by conducting ratcheting fatigue tests. In addition, three modified models based on Basquin equation were used to predict the ratcheting fatigue life of nanosilver sintered lap shear joint and their accuracies were evaluated.
Findings
When the sintering temperature is 250°C, the nanosilver sintered lap shear joint shows the porosity of 22.9 ± 1.6 %, and the shear strength of 22.3 ± 2.4 MPa. Raising the sintering temperature enhances silver crystallite size, strengthens sintering necks, thus improves shear strength and ratcheting fatigue life in joints. In addition, the ratcheting fatigue lives of the joints sintered at different temperatures are effectively predicted by three equivalent force models, and the Gerber model shows the highest life prediction accuracy.
Research limitations/implications
The sintered silver bondline is suffering a complex stress state. The study only takes the shear stress into consideration. The tensile stress and the combination of shear stress and tensile stress can to be considered in the future study.
Practical implications
The paper provides the experimental and theoretical support for robust bonding and long-term reliability of sintered silver structure.
Social implications
The introduced model can predict the ratcheting fatigue lives of the joints sintered at different temperatures, which shows a potential in engineering applications.
Originality/value
The study revealed the relationship between the sintering temperature and the microstructure, the shear strength and the ratcheting fatigue life of the joint. In addition, the Gerber model can predict the ratcheting fatigue life accurately at different sintering temperatures.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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