Guoshun Wan , Qi Dong , Xiaochen Sun , Hao Zheng , Mengxuan Cheng , Wen Qiao , Yuxi Jia
{"title":"利用 CNN 预测导电层的均匀热机械特性,用于电子产品可靠性数值分析","authors":"Guoshun Wan , Qi Dong , Xiaochen Sun , Hao Zheng , Mengxuan Cheng , Wen Qiao , Yuxi Jia","doi":"10.1016/j.microrel.2024.115400","DOIUrl":null,"url":null,"abstract":"<div><p>This study explores the application of Convolutional Neural Networks (CNN) in predicting the partitioned homogeneous properties (PHPs) of electronic product wiring structures, aiming to enhance the efficiency of reliability analysis through Finite Element Analysis (FEA). A systematic and novel method was developed to generate the input partitioned wiring diagram image sets that foster model generalization and universality. The performance of the CNN-based approach was assessed through regression analysis by employing a leave-one-out cross-validation (LOOCV) approach across three PCBs. Additionally, the predicted PHPs of one of the PCBs were applied in product-level FEA to validate their reliability, further demonstrating the practical applicability of the CNN-based method. The results demonstrate that a well-trained CNN model can accurately predict the properties of previously unencountered wiring structures, thereby facilitating direct application in product-level reliability FEA and improving the efficiency of reliability assessment. Furthermore, efficiency evaluation revealed that the CNN-based method offers significant advantages in terms of time and cost economy compared to the mesoscopic FEA method in determining, highlighting its potential for broader application in electronic product reliability analysis. The findings provide preliminary insights and propose strategies to enhance the applicability of CNN methods in this domain, ultimately aiming to improve the efficiency and reduce costs in reliability assessments, thereby streamlining the overall product development process.</p></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics\",\"authors\":\"Guoshun Wan , Qi Dong , Xiaochen Sun , Hao Zheng , Mengxuan Cheng , Wen Qiao , Yuxi Jia\",\"doi\":\"10.1016/j.microrel.2024.115400\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This study explores the application of Convolutional Neural Networks (CNN) in predicting the partitioned homogeneous properties (PHPs) of electronic product wiring structures, aiming to enhance the efficiency of reliability analysis through Finite Element Analysis (FEA). A systematic and novel method was developed to generate the input partitioned wiring diagram image sets that foster model generalization and universality. The performance of the CNN-based approach was assessed through regression analysis by employing a leave-one-out cross-validation (LOOCV) approach across three PCBs. Additionally, the predicted PHPs of one of the PCBs were applied in product-level FEA to validate their reliability, further demonstrating the practical applicability of the CNN-based method. The results demonstrate that a well-trained CNN model can accurately predict the properties of previously unencountered wiring structures, thereby facilitating direct application in product-level reliability FEA and improving the efficiency of reliability assessment. Furthermore, efficiency evaluation revealed that the CNN-based method offers significant advantages in terms of time and cost economy compared to the mesoscopic FEA method in determining, highlighting its potential for broader application in electronic product reliability analysis. The findings provide preliminary insights and propose strategies to enhance the applicability of CNN methods in this domain, ultimately aiming to improve the efficiency and reduce costs in reliability assessments, thereby streamlining the overall product development process.</p></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2024-04-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271424000805\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424000805","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics
This study explores the application of Convolutional Neural Networks (CNN) in predicting the partitioned homogeneous properties (PHPs) of electronic product wiring structures, aiming to enhance the efficiency of reliability analysis through Finite Element Analysis (FEA). A systematic and novel method was developed to generate the input partitioned wiring diagram image sets that foster model generalization and universality. The performance of the CNN-based approach was assessed through regression analysis by employing a leave-one-out cross-validation (LOOCV) approach across three PCBs. Additionally, the predicted PHPs of one of the PCBs were applied in product-level FEA to validate their reliability, further demonstrating the practical applicability of the CNN-based method. The results demonstrate that a well-trained CNN model can accurately predict the properties of previously unencountered wiring structures, thereby facilitating direct application in product-level reliability FEA and improving the efficiency of reliability assessment. Furthermore, efficiency evaluation revealed that the CNN-based method offers significant advantages in terms of time and cost economy compared to the mesoscopic FEA method in determining, highlighting its potential for broader application in electronic product reliability analysis. The findings provide preliminary insights and propose strategies to enhance the applicability of CNN methods in this domain, ultimately aiming to improve the efficiency and reduce costs in reliability assessments, thereby streamlining the overall product development process.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.