利用 CNN 预测导电层的均匀热机械特性,用于电子产品可靠性数值分析

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Guoshun Wan , Qi Dong , Xiaochen Sun , Hao Zheng , Mengxuan Cheng , Wen Qiao , Yuxi Jia
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引用次数: 0

摘要

本研究探讨了卷积神经网络(CNN)在预测电子产品布线结构的分区均匀特性(PHPs)中的应用,旨在通过有限元分析(FEA)提高可靠性分析的效率。研究人员开发了一种系统的新方法来生成输入的分区布线图图像集,以促进模型的通用性和普遍性。通过对三种印刷电路板采用留空交叉验证(LOOCV)方法进行回归分析,评估了基于 CNN 方法的性能。此外,在产品级有限元分析中应用了其中一个印刷电路板的 PHP 预测值,以验证其可靠性,从而进一步证明了基于 CNN 方法的实用性。结果表明,训练有素的 CNN 模型可以准确预测以前未遇到过的布线结构的属性,从而有助于直接应用于产品级可靠性有限元分析,并提高可靠性评估的效率。此外,效率评估显示,与确定的介观有限元分析方法相比,基于 CNN 的方法在时间和成本经济性方面具有显著优势,突出了其在电子产品可靠性分析中更广泛应用的潜力。研究结果为提高 CNN 方法在这一领域的适用性提供了初步见解和策略建议,最终旨在提高可靠性评估的效率并降低成本,从而简化整个产品开发流程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics

This study explores the application of Convolutional Neural Networks (CNN) in predicting the partitioned homogeneous properties (PHPs) of electronic product wiring structures, aiming to enhance the efficiency of reliability analysis through Finite Element Analysis (FEA). A systematic and novel method was developed to generate the input partitioned wiring diagram image sets that foster model generalization and universality. The performance of the CNN-based approach was assessed through regression analysis by employing a leave-one-out cross-validation (LOOCV) approach across three PCBs. Additionally, the predicted PHPs of one of the PCBs were applied in product-level FEA to validate their reliability, further demonstrating the practical applicability of the CNN-based method. The results demonstrate that a well-trained CNN model can accurately predict the properties of previously unencountered wiring structures, thereby facilitating direct application in product-level reliability FEA and improving the efficiency of reliability assessment. Furthermore, efficiency evaluation revealed that the CNN-based method offers significant advantages in terms of time and cost economy compared to the mesoscopic FEA method in determining, highlighting its potential for broader application in electronic product reliability analysis. The findings provide preliminary insights and propose strategies to enhance the applicability of CNN methods in this domain, ultimately aiming to improve the efficiency and reduce costs in reliability assessments, thereby streamlining the overall product development process.

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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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