通过电热模拟实现硅锗超短路栅晶体管性能

IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Shiun Yamakiri;Takaya Sugiura;Kenta Yamamura;Yuta Watanabe;Nobuhiko Nakano
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引用次数: 0

摘要

作为传统硅(Si)的替代材料,锗(Ge)材料引起了人们的兴趣,因为锗具有更大的载流子迁移率,有利于高速开关。本研究采用电热分析法研究了硅锗(SiGe)超短路栅晶体管的性能。硅锗的材料特性可以通过调节 Si$_{1-x}$ Ge$_{x}$ 的分子分数来改变,而不同的材料特性会影响纳米级晶体管的性能,因为沟道调节在很大程度上取决于带隙能。本研究旨在揭示 SiGe 晶体管的结构和材料设计,以确保足够的性能和可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon-Germanium Ultrashort-Gate Transistor Performances by Electrical-Thermal Simulations
As a replacement for conventional silicon (Si), the germanium (Ge) materials have attracted interest because Ge provides larger carrier mobility and is advantageous for high-speed switching. In this study, the silicon-germanium (SiGe) ultrashort-gate transistor performances were studied using electrical-thermal analysis. The material properties of SiGe can be modified by regulating the mole fraction in Si $_{1-x}$ Ge $_{x}$ , and the different material characteristics affect the nanoscale transistor performance because channel regulation strongly depends on the bandgap energy. This study aims to reveal the structural and material designs of SiGe transistors to ensure sufficient performance and reliability.
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来源期刊
IEEE Transactions on Nanotechnology
IEEE Transactions on Nanotechnology 工程技术-材料科学:综合
CiteScore
4.80
自引率
8.30%
发文量
74
审稿时长
8.3 months
期刊介绍: The IEEE Transactions on Nanotechnology is devoted to the publication of manuscripts of archival value in the general area of nanotechnology, which is rapidly emerging as one of the fastest growing and most promising new technological developments for the next generation and beyond.
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