用于检测制造缺陷的 6T SRAM 中位晶体管阈值电压偏差监控方案

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Rui Liu;Hao Li;Zhao Yang;Guantao Wang;Zefu Chen;Peiyong Zhang
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引用次数: 0

摘要

工艺波动导致的晶体管随机阈值电压变化严重影响了静态随机存取存储器(SRAM)的稳定性。本文提出了一种 SRAM 位晶体管阈值电压 $({Vth})$ 偏差监控方案和系统。该方案巧妙地实现了对所有晶体管阈值电压的片上测量,而无需改变紧凑的 SRAM 位阵列布局。针对不同类型的被测器件(DUT),提出了控制信号策略和晶体管{Vth}$确定电路(TVDC)。系统采用 65 纳米 CMOS 工艺实现,核心面积为 0.01875 平方毫米。通过蒙特卡罗分析,所提方案与直接测量方法的加权平均(WA)差值不超过 10mV,均方根误差(RMSE)差值不超过 3mV。该系统还能通过修改基板电压有效检测晶体管阈值电压失配模拟的单元位置。对于不同规模的 SRAM 阵列,本文提出的方法具有面积效率和灵活的可重构性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Threshold Voltage Deviation Monitoring Scheme of Bit Transistors in 6T SRAM for Manufacturing Defects Detection
Transistor random threshold voltage variations due to process fluctuations seriously affects the stability of Static Random Access Memory (SRAM). In this paper, a SRAM bit transistors threshold voltage $({Vth})$ deviation monitoring scheme and system is proposed. This scheme ingeniously achieves on-chip measurement of all transistors threshold voltages without altering compact SRAM bit array layout. Control signal strategies and Transistor ${Vth}$ Determination Circuit (TVDC) for different types of Devices Under Test (DUTs) have been proposed. The system is implemented using a 65 nm CMOS process with a core area of 0.01875mm2. Through Monte Carlo analysis, the Weighted Average (WA) difference of the proposed scheme and the direct measurement method is not more than 10mV, and the Root Mean Square Error (RMSE) difference is not more than 3mV. This system can also effectively detect the cell position of the transistor threshold voltage mismatch simulated by modifying the substrate voltage. For SRAM arrays of different scales, the method proposed in this paper has area efficiency and flexible reconfigurability.
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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