基于扩展卡尔曼滤波器的热压焊温度控制方法

IF 1.7 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Min Zeng, Jianxing Xie, Zhitao Li, Qincheng Wei, Hui Yang
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引用次数: 0

摘要

设计/方法/途径温度优化控制与基于 EKF 的闭环比例积分微分(PID)控制方法相结合。从温度控制、误差和抗干扰角度研究了测量热电偶温度的不同控制方法。在半工业环境中执行了一个焊接过程。提出的控制方法适用于柔性印刷电路和电路板的焊接。研究结果所提出的方法不仅能估计焊接温度,还能消除系统噪声。该方法的性能堪称典范,其特点是收敛速度快,误差范围可忽略不计。与传统控制相比,拟议控制的温度可变性显著降低。原创性/价值设计了一个 EKF 来估计热压焊过程中热电偶的温度。利用 EKF 和 PID 控制器,可以有效克服系统的非线性特性,降低干扰和系统噪声的影响。所提出的方法大大提高了热压焊的温度控制性能,有效抑制了超调,缩短了调节时间,从而实现了对被控对象的精确温度控制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A temperature control method of hot-bar soldering based on extended Kalman filter

Purpose

This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter (EKF) to estimate the temperature of the thermocouple.

Design/methodology/approach

Temperature optimal control is combined with a closed-loop proportional integral differential (PID) control method based on an EKF. Different control methods for measuring the temperature of the thermode in terms of temperature control, error and antidisturbance are studied. A soldering process in a semi-industrial environment is performed. The proposed control method was applied to the soldering of flexible printed circuits and circuit boards. An infrared camera was used to measure the top-surface temperature.

Findings

The proposed method can not only estimate the soldering temperature but also eliminate the noise of the system. The performance of this methodology was exemplary, characterized by rapid convergence and negligible error margins. Compared with the conventional control, the temperature variability of the proposed control is significantly attenuated.

Originality/value

An EKF was designed to estimate the temperature of the thermocouple during hot-bar soldering. Using the EKF and PID controller, the nonlinear properties of the system could be effectively overcome and the effects of disturbances and system noise could be decreased. The proposed method significantly enhanced the temperature control performance of hot-bar soldering, effectively suppressing overshoot and shortening the adjustment time, thereby achieving precise temperature control of the controlled object.

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来源期刊
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 工程技术-材料科学:综合
CiteScore
4.10
自引率
15.00%
发文量
30
审稿时长
>12 weeks
期刊介绍: Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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