Mingyue Zheng;Wangyong Chen;Yaoyang Lyu;Linlin Cai
{"title":"面向先进技术的数字电路零温延点可靠性与优化仿真研究","authors":"Mingyue Zheng;Wangyong Chen;Yaoyang Lyu;Linlin Cai","doi":"10.1109/TDMR.2023.3344639","DOIUrl":null,"url":null,"abstract":"Thermal challenges are increasingly significant for advanced technology, and the operating environment with large temperature variation also acts as one of the crucial threats to the system’s performance and reliability. To improve the temperature immunity of digital circuits, in this work, the supply voltage (VDD) making the delay immune to temperature variation is identified, which differs from the zero-temperature-coefficient (ZTC) point used in analog applications and is defined as the zero-temperature-delay (ZTD) point. The dependencies and optimal selection of ZTD point in digital circuits are studied by simulation. The influence factors including standard cell types and circuit operations have been investigated accordingly. Moreover, the exploration of ZTD point with different delay metrics is discussed, which is the basis of the selection of ZTD point at standard cell level. The ZTD point changes due to the five PVT corners and the selection of the ZTD point under these PVT corners are studied. Taking three kinds of delay chains and benchmark circuits as an example, the ZTD point in the critical path of the circuit is further investigated. The simulation results confirm that utilizing the ZTD voltage during the design of digital circuits can provide a better temperature-resistant solution, which makes sense for temperature immunity digital applications.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 1","pages":"77-83"},"PeriodicalIF":2.5000,"publicationDate":"2023-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reliability and Optimization Simulation Study of Zero-Temperature-Delay Point in Digital Circuits for Advanced Technology\",\"authors\":\"Mingyue Zheng;Wangyong Chen;Yaoyang Lyu;Linlin Cai\",\"doi\":\"10.1109/TDMR.2023.3344639\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal challenges are increasingly significant for advanced technology, and the operating environment with large temperature variation also acts as one of the crucial threats to the system’s performance and reliability. To improve the temperature immunity of digital circuits, in this work, the supply voltage (VDD) making the delay immune to temperature variation is identified, which differs from the zero-temperature-coefficient (ZTC) point used in analog applications and is defined as the zero-temperature-delay (ZTD) point. The dependencies and optimal selection of ZTD point in digital circuits are studied by simulation. The influence factors including standard cell types and circuit operations have been investigated accordingly. Moreover, the exploration of ZTD point with different delay metrics is discussed, which is the basis of the selection of ZTD point at standard cell level. The ZTD point changes due to the five PVT corners and the selection of the ZTD point under these PVT corners are studied. Taking three kinds of delay chains and benchmark circuits as an example, the ZTD point in the critical path of the circuit is further investigated. The simulation results confirm that utilizing the ZTD voltage during the design of digital circuits can provide a better temperature-resistant solution, which makes sense for temperature immunity digital applications.\",\"PeriodicalId\":448,\"journal\":{\"name\":\"IEEE Transactions on Device and Materials Reliability\",\"volume\":\"24 1\",\"pages\":\"77-83\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2023-12-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Device and Materials Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10365675/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10365675/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Reliability and Optimization Simulation Study of Zero-Temperature-Delay Point in Digital Circuits for Advanced Technology
Thermal challenges are increasingly significant for advanced technology, and the operating environment with large temperature variation also acts as one of the crucial threats to the system’s performance and reliability. To improve the temperature immunity of digital circuits, in this work, the supply voltage (VDD) making the delay immune to temperature variation is identified, which differs from the zero-temperature-coefficient (ZTC) point used in analog applications and is defined as the zero-temperature-delay (ZTD) point. The dependencies and optimal selection of ZTD point in digital circuits are studied by simulation. The influence factors including standard cell types and circuit operations have been investigated accordingly. Moreover, the exploration of ZTD point with different delay metrics is discussed, which is the basis of the selection of ZTD point at standard cell level. The ZTD point changes due to the five PVT corners and the selection of the ZTD point under these PVT corners are studied. Taking three kinds of delay chains and benchmark circuits as an example, the ZTD point in the critical path of the circuit is further investigated. The simulation results confirm that utilizing the ZTD voltage during the design of digital circuits can provide a better temperature-resistant solution, which makes sense for temperature immunity digital applications.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.