第 42 届国际计算机辅助设计大会(ICCAD 2023)回顾

IF 1.9 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Evangeline Young
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引用次数: 0

摘要

在 COVID-19 大流行之后,今年标志着我们重返完全面对面的计算机辅助设计国际会议 (ICCAD)。我们很高兴能重新举办一次具有个人互动和广泛网络的活动,同时保留了大流行病期间采用的一些良好做法,即通过虚拟平台让与会者和作者进行远程联系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Recap of the 42nd Edition of the International Conference on Computer- Aided Design (ICCAD 2023)
This Year Marks our return to a fully in-person International Conference on Computer-Aided Design (ICCAD) after the COVID-19 pandemic. We are thrilled to resume an event with personal interactions and extensive networking while retaining some good practices adopted during the pandemic of having a virtual platform where participants and authors can connect remotely.
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来源期刊
IEEE Design & Test
IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
3.80
自引率
5.00%
发文量
98
期刊介绍: IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.
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